Mechanical Characterisation and Modelling of Thin Chips

  • Stephan Schoenfelder
  • Joerg Bagdahn
  • Mattias Petzold
Chapter

Abstract

In order to ensure reliable products, electronic, as well as mechanical, properties of thin chips must also be characterised. In particular, the strength of silicon devices is an important key for improvement of the yield and avoidance of the fracture of silicon chips and devices in manufacturing and application, respectively. This chapter discusses strength parameter in detail and how strength of thin silicon chips can be analysed. Besides theoretical relations, examples of strength behaviour of thin silicon chips are presented regarding different manufacturing steps.

Keywords

Brittle Grinding 

Notes

Acknowledgements

The results being presented here has been enabled by different public funded projects during the last few years in the field of microelectronics and photovoltaics. The authors gratefully acknowledge the funding from the Kultusministerium Sachsen-Anhalt (contract no. 0037 KL/0903B) and the Federal Ministry of Education and Research within the Innoprofile initiative ‘SiThinSolar’ (contract no. 03IP607).

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Copyright information

© Springer Science+Business Media, LLC 2011

Authors and Affiliations

  • Stephan Schoenfelder
    • 1
  • Joerg Bagdahn
  • Mattias Petzold
  1. 1.Fraunhofer Institute for Mechanics of MaterialsHalleGermany

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