Abstract
This chapter contains a broad review of SiC materials and processing technology necessary to create SiC electronics, micromechanical transducers, and packaging. Details on deposition and etching methods are covered. The material properties of various forms of SiC (single crystalline, polycrystalline, and amorphous) along with their use for creating the various components of harsh environment microsystems will also be discussed. Current status and future research are highlighted with regards to both materials and processing technologies.
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Wijesundara, M.B.J., Azevedo, R.G. (2011). SiC Materials and Processing Technology. In: Silicon Carbide Microsystems for Harsh Environments. MEMS Reference Shelf, vol 22. Springer, New York, NY. https://doi.org/10.1007/978-1-4419-7121-0_2
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