Skip to main content

A Single-Chip Dual-Band 22–29-GHz/77–81-GHz BiCMOS Transceiver

  • Chapter
  • First Online:
Book cover Automotive Radar Sensors in Silicon Technologies
  • 2422 Accesses

Abstract

A clear trend in wireless applications during the last decade has been the push towards higher integration, and multi-mode and multi-band operation, in order to enable low-cost high-functionality consumer devices. As the deployment of silicon-based MMW technology becomes widespread, similar trends may be expected in the MMW space

This work was done in collaboration with Fred Tzeng and Lei Zhou [5], [47].

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 84.99
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 119.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 109.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Vipul Jain .

Rights and permissions

Reprints and permissions

Copyright information

© 2013 Springer Science+Business Media New York

About this chapter

Cite this chapter

Jain, V., Heydari, P. (2013). A Single-Chip Dual-Band 22–29-GHz/77–81-GHz BiCMOS Transceiver. In: Automotive Radar Sensors in Silicon Technologies. Springer, New York, NY. https://doi.org/10.1007/978-1-4419-6775-6_6

Download citation

  • DOI: https://doi.org/10.1007/978-1-4419-6775-6_6

  • Published:

  • Publisher Name: Springer, New York, NY

  • Print ISBN: 978-1-4419-6774-9

  • Online ISBN: 978-1-4419-6775-6

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics