Advertisement

Electromagnetic Compatibility

  • Nobuyasu Kanekawa
  • Eishi H. Ibe
  • Takashi Suga
  • Yutaka Uematsu
Chapter

Abstract

Electromagnetic interference (EMI) causes malfunctions in electronic devices or components, resulting in hazardous consequences as soft and hard errors do. Electromagnetic compatibility (EMC) is defined as the ability of a device, equipment, or system to function satisfactorily in its electromagnetic environment without introducing intolerable electromagnetic disturbances to anything in that environment [1].

Keywords

Current Distribution Radiate Emission Magnetic Field Distribution Anechoic Chamber Layout Data 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

References

  1. 1.
    IEEE Editorial Policy Statement, “IEEE Transactions on Electromagnetic Compatibility,” EMC-29, pp. 202–206 (1987).Google Scholar
  2. 2.
    N. Kobayashi, K. Morishita, M. Kusumoto, T. Harada, and T. Hubing, “Coupling Analysis of PCB-Chassis Systems with Signal Lines and Via Structures using SPICE,” Proceedings of the 2006 International Symposium on EMC, Portland, OR, USA, August 2006 (2006).Google Scholar
  3. 3.
    D. Baudly, F. Bicrel, L. Bouchelouk, A. Louis, B. Mazari, and P. Eudeline, “Near-Field Techniques for Detecting EMI Sources”, Proceedings of the 2004 International Symposium on EMC, Sendai, Japan, Vol. 1, pp. 11–13 (2004).Google Scholar
  4. 4.
    J. Shi, M. A. Cracraft, J. Zhang, R. E. DuBroff, K. Slattery, and M. Yamaguchi, “Using Near-Field Scanning to Predict Radiated FIELDS”, Proceedings of the 2004 International Symposium on EMC, Sendai, Japan, Vol. 1, pp. 14–18 (2004).Google Scholar
  5. 5.
    X. Dong, S. Deng, T. Hubing, and D. Beetner, “Analysis of Chip-Level EMI Using Near-Field Magnetic Scanning”, Proceedings of the 2004 International Symposium on EMC, Sendai, Japan, Vol. 1, pp. 174–177 (2004).Google Scholar
  6. 6.
    V.P. Kodali, “Engineering Electromagnetic Compatibility,” IEEE Press, (1996).Google Scholar
  7. 7.
    J. Galejs, “Admittance of a Rectangular Slot Which is Backed by a Rectangular Cavity,” IEEE Trans. Antennas Propag., Vol. AP–11, pp. 119–126 (1963).CrossRefGoogle Scholar
  8. 8.
    H.A. Mendez, “Shielding Theory of Enclosures with Apertures,” IEEE Trans. Electromagn. Compat., Vol. EMC-20, pp. 296–305 (1978).CrossRefGoogle Scholar
  9. 9.
    G. Cerri, R.D. Leo, and V.M. Primiani, “Theoretical and Experimental Evaluation of the Electromagnetic Radiation from Apertures in Shielded Enclosure,” IEEE Trans. Electromagn. Compat., Vol. 34, pp. 423–432 (November 1992).CrossRefGoogle Scholar
  10. 10.
    M. Li, J.L. Drewniak, S. Radu, J. Nuebel, T.H. Hubing, R.E. DuBroff, and T.P. Van Doren, “An EMI Estimate for Shielding-Enclosure Evaluation,” IEEE Trans. Electromagn. Compat., Vol. 43, No. 3, pp. 295–304 (2001).CrossRefGoogle Scholar
  11. 11.
    S. Daijavad, and B.J. Rubin, “Modeling Common-Mode Radiation of 3-D Structures”, IEEE Trans. Electromagn. Compat., Vol. 34, pp. 57–61 (1992).CrossRefGoogle Scholar
  12. 12.
    M. Li, J. Nuebel, J.L. Drewniak, R.E. DuBroff, T.H. Hubing, and T.P. VanDoren, “EMI from Cavity Modes of Shielding Enclosures-FDTD Modeling and Measurements,” IEEE Trans. Electromagn. Compat., Vol. 42, pp. 29–38 (2000).CrossRefGoogle Scholar
  13. 13.
    M. Leone, and G. Mönich, “Coupling of Apertures in Enclosures to External Cabling Structures,” IEEE Trans. Electromagn. Compat., Vol. 46, pp. 107–110 (2004).CrossRefGoogle Scholar
  14. 14.
    N. Kobayashi, T. Harada, A. Shaik, and T. Hubing, “An investigation of the effect of chassis connections on radiated EMI from PCBs,” Proceedings of the 2006 IEEE International Symposium on Electromagnetic Compatibility, Portland, OR, USA, August 2006, WEAM-2-1 (2006).Google Scholar
  15. 15.
    H. Funato, and T. Suga, “A Study on Correlation between the PCB Layout and EMI from Chassis”, Proceedings of the 2007 International Symposium on EMC, Qingdao, China, July 2007 (2007).Google Scholar

Copyright information

© Springer Science+Business Media, LLC 2011

Authors and Affiliations

  • Nobuyasu Kanekawa
    • 1
  • Eishi H. Ibe
    • 2
  • Takashi Suga
    • 2
  • Yutaka Uematsu
    • 2
  1. 1.Hitachi Research LaboratoryHitachi, Ltd.IbarakiJapan
  2. 2.Production Engineering Research LaboratoryHitachi, Ltd.KanagawaJapan

Personalised recommendations