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Use of AC Coupled Interconnect in Contactless Packaging

  • Paul Franzon
Chapter
Part of the Integrated Circuits and Systems book series (ICIR, volume 0)

Abstract

Contactless packaging refers to the concept of using capacitively coupled or inductively coupled structures to connect chips together. That is, to use them as the electrical interfaces for chip-to-package, package-to-socket, and board-to-board interfaces (i.e. connectors). Collectively, these techniques are referred to as “AC Coupled Interconnect,” (ACCI) referring to the lack of a DC connection. These concepts arise from the key realization that a DC connection is not needed to communicate high frequency digital data; a good AC connection suffices. In fact, many high speed chip-to-chip communication standards, such as FiberChannel and Ethernet, use DC blocking capacitors so that the transmitter and receiver do not have to share a common DC supply, making them hot-pluggable. The difference in ACCI is the realization that smaller values of capacitance can be used.

Keywords

Return Loss Solder Bump Capacitive Coupling Series Capacitor Series Capacitance 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media, LLC 2010

Authors and Affiliations

  1. 1.Department of Electrical and Computer EngineeringNorth Carolina State UniversityRaleighUSA

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