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Inductive Coupled Communications

  • Noriyuki Miura
  • Takayasu Sakurai
  • Tadahiro Kuroda
Chapter
Part of the Integrated Circuits and Systems book series (ICIR, volume 0)

Abstract

Inductive coupled communication is a wireless communication technology for three-dimensionally (3D) stacked chips in a package. As discussed in a previous chapter, capacitive coupled communication (see Figure 4.1) utilizes a pair of metal electrodes which forms a capacitive-coupling channel–essentially a capacitor–as a vertical wireless data link between stacked chips. In inductive coupled communication, a pair of metal coils creates an inductive-coupling channel–essentially a transformer–between stacked chips. Both of these are pure digital circuit solutions compatible with a standard CMOS technology. The metal electrodes and/or the metal coils can be fabricated by using IC interconnections.

Keywords

Dynamic Voltage Scaling Pseudo Random Binary Sequence Layout Area Burst Transmission Channel Pitch 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media, LLC 2010

Authors and Affiliations

  • Noriyuki Miura
    • 1
  • Takayasu Sakurai
    • 2
  • Tadahiro Kuroda
    • 1
  1. 1.Department of Electrical EngineeringKeio UniversityKohoku-kuJapan
  2. 2.Institute of Industrial ScienceUniversity of TokyoMeguro-kuJapan

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