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Electronic Packaging Structures

  • Y.-L. Shen
Chapter

Abstract

In conjunction with the advancement of microelectronics, the art and technology of electronic packaging have progressed rapidly over the last several decades. Packaging protects the semiconductor or other electronic systems from external environment during manufacturing, assembly, shipping, handling and normal operation. It also serves to facilitate power delivery and thermal management (to maintain the device temperature below certain limits). A package is thus a combination of dissimilar materials in close contact, leading to deformation mismatches and internal stress buildup as a result of thermal and mechanical loads [1–7].

Keywords

Shear Strain Solder Joint Print Circuit Board Equivalent Plastic Strain Maximum Principal Stress 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media, LLC 2010

Authors and Affiliations

  • Y.-L. Shen
    • 1
  1. 1.Dept. Mechanical EngineeringUniversity of New MexicoAlbuquerqueUSA

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