Thermal Modeling for Processors and Systems-on-Chip



Chip power density and consequently on-chip hot spot temperature have been increasing steadily as a result of non-ideal technology scaling, leading to severely thermally constrained designs. In this chapter, we review a chip- and package-level thermal modeling and simulation approach, HotSpot, that is unique because it is compact, correct by construction, flexible, and parameterized. HotSpot is important for temperature-aware design, especially during early pre-RTL stages of SoC and processor designs. Several case studies further illustrate the necessity of thermal simulations and the usefulness of HotSpot.


Solder Ball Design Flow Leakage Power Heat Spreading Thermal Interface Material 
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© Springer Science+business Media, LLC 2010

Authors and Affiliations

  1. 1.Department of Computer ScienceUniversity of VirginiaCharlottesvilleUSA
  2. 2.University of VirginiaCharlottesvilleUSA
  3. 3.IBM ResearchAustinUSA

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