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Thinning Preparation Techniques

  • Jeanne Ayache
  • Luc Beaunier
  • Jacqueline Boumendil
  • Gabrielle Ehret
  • Danièle Laub
Chapter

Abstract

This technique is used to produce a thin slice (measuring 3 mm in diameter and between 50- and 100-μm thick) without strain hardening, by thinning until a perforation is made in the center. The resulting hole has electron-transparent thin edges.

Keywords

Thin Slice Specimen Holder Window Technique Multiphase Material Electrochemical Polishing 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Copyright information

© Springer Science+Business Media, LLC 2010

Authors and Affiliations

  • Jeanne Ayache
    • 1
  • Luc Beaunier
    • 2
  • Jacqueline Boumendil
    • 3
  • Gabrielle Ehret
    • 4
  • Danièle Laub
    • 5
  1. 1.Laboratoire de Microscopie Moléculaire et CellulaireInstitut Gustave Roussy, Unité mixte, CNRS-UMR8126-IGRVillejuif CXFrance
  2. 2.Labo. Interfaces et Systémes ElectrochimiquesUniversité Paris VI, UPR 15 CNRSParis CX 05France
  3. 3.Centre de Microscopie Electronique, Appliquée à la Biologie et à la GéologieUniversité Lyon IVilleurbanne CXFrance
  4. 4.Inst. Physique et Chimie des MatériauxUniversité Strasbourg, CNRS-UMR 7504Strasbourg CX 2France
  5. 5.Faculté des Sciences de Base, Centre Interdisciplinaire de Microscopie ElectroniqueEcole Polytechnique Fédérale de LausanneLausanneSwitzerland

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