Abstract
Solder joint reliability is the ability of solder joints to function under given conditions and to remain in conformance to both mechanical and electrical specifications for a specified period of time (without failing within the intended operating time).
In general, a particular failure mode is the result of certain failure mechanisms in which certain specific combinations of material properties and the surrounding environment act simultaneously. Many different factors have to be considered when assessing the reliability performance of a solder joint structure, such as stress distribution, strain amplitude, strain rate, the cyclic nature of the stress (mechanical, thermal, and thermomechanical), temperature, and many other environmental factors (corrosion, vibration, and so on). Apart from these, the metallurgical and physical behavior of the solder and the solder joint are also very important to take into account, since these also highly affect the reliability behavior of the solder joint.
The aim of this chapter is to increase the knowledge regarding reliability and failure of lead-free solder alloys/joints. This chapter gives an insight into how the microstructure of some lead-free solders is built its stability and some interfacial reactions. An introduction is also given to the failure mechanisms of solder joints, including fatigue failure, which is one of the most significant threats to the integrity of solder joints. Both the effect of second-level solder interconnection and some common standards used when testing solder joint reliability are also mentioned in this chapter.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
M. Abtew, “Lead free solders for surface mount technology applications (Part 1),” Chip Scale Review, 1998, http://www.chipscalereview.com/9809/m.abtew1.htm.
P. G. Harris, K. S. Chaggar, “The role of intermetallic compounds in lead-free soldering,” Soldering & Surface Mount Technology, 10(3), 1998, 38–52.
Y. C. Chan, P. L. Tu, A. C. K So, J. K. L. Lai, “Effect of intermetallic compounds on the shear fatigue of Cu/63Sn–Pb solder joints,” IEEE Transactions on Components, Hybrids and Manufacturing Technology-Part B, 20(1), 1997, 87–93.
Z. Guo, P. Hacke, A. F. Sprecher, H. Conrad, “Effect of composition on the low-cycle fatigue of Pb alloy solder joints,” 40th Electronic Components and Technology Conference, Las Vegas, NV, 1, 1990, 496–504.
H. D. Blair, P. Tsung-Yu, J. M. Nicholson, “Intermetallic compound growth on NI, Au/Ni, and Pd/Ni susbstrates with Sn/Pb, Sn/Ag, and Sn solders,” 48th Electronic Components and Technology Conference, Seattle, WA, 1998, 259–267.
W. Engelmaier, “Solder Joints in Electronics: Design for Reliability”, in Design and Reliability of Solders and Solder Interconnections, Edited by R.K. Mahidhara et al. The Minerals, Metals & Materials Society, Gaithersburg, MD, 1997, 9–13.
J. W. Morris, H. J. Reynolds, “The Influence of Microstructure on the Failure of Eutectic Solders” in Design and Reliability of Solders and Solder Interconnections, Edited by R. K. Mahidhara, S.M.L. Sastry, P.K. Liaw, K.L. Murty, D.R. Frear, and W.L. Winterbottom, The Minerals, Metals & Materials Society, Gaithersburg, MD, 1997, 49–58.
M. A. Matin, W. P. Vellinga, M. G. D. Geers, “Thermomechanical fatigue damage evolution in SAC solder joints,” Materials Science and Engineering, A, doi: 10, 1016/j.msea. 9, 2006, 37.
L. L. Ye, Z. Lai, J. Liu, A. Thölén, “Microstructural coarsening of lead free solder joints during thermal cycling,” IEEE, Electronic Components and Technology Conference, Las Vegas, NV, 2000, 134–137.
P. Towashiraporn, K. Gall, G. Subbarayan, B. McIlvanie, B. C. Hunter, D. Love, B. Sullivan, “Power cycling thermal fatigue of Sn–Pb solder joints on a chip scale package,” International Journal of Fatigue, 26(5), 2004, 497–510.
P. G. Harris, K. S. Chaggar, M. A. Whitmore, “The effect of ageing on the microstructure of tin–lead alloys,” Soldering and Surface Mount Technology, 7, 1991, 24–33.
R. Agarwal, S. E. Ou, K. N. Tu, “Electromigration and critical product in eutectic SnPb solder lines at 100°C,” Journal of Applied Physics, 100(024909), 2006, 1–5.
H. Ye, C. Basaran, D. C. Hopkins, “Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing,” International Journal of Solids and Structures, 41, 2004, 2743–2755.
H. L. J. Pang, K. H. Tan, X. Q. Shi, Z. P. Wang, “Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging,” Materials Science and Engineering, A, 307, 2001, 42–50.
J. W. Jang, A. De Silva, J. K. Lin, D. Frear, “Mechanical tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps,” IEEE Electronic Components and Technology Conference, 2003, 680–684.
R. Erich, R. J. Coyle, G. M. Wenger, A. Primavera, “Shear testing and failure mode analysis for evaluating BGA ball attachment,” IEEE/CPMT, International Electronics Manufacturing Technology Symposium, Austin, TX, 1999, 16–22.
S. W. Kim, J. W. Yoon, S. B. Jung, “Interfacial reactions and shear strengths between Sn–Ag based Pb-free solder balls and Au/EN/Cu metallization,” Journal of Electronic Materials, 33(10), 2004, 1182–1189.
A. Sharif, Y. C. Chan, M. N. Islam, M. J. Rizvi, “Dissolution of electroless Ni metallization by lead-free solder alloys,” Journal of Alloys and Compounds, 388(1), 2005, 75–82.
P. L. Liu, J. K. Shang, “Influence of microstructure on fatigue crack growth behavior of Sn-Ag solder interface,” Journal of Electronic Materials, 29(5), 2000, 622–627.
K. S. Kim, S. H. Huh, K. Suganuma, “Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints,” Journal of Alloys and Compounds, 352, 2003, 226–236.
Q. Xiao, H. J. Bailey, W. D. Amstrong, “Aging effects on microstructure and tensile property of Sn3.9Ag0.6Cu solder alloy,” Journal of Electronic Packaging, 126(2), 2004, 208–212.
B. F. Dyson, “Diffusion of gold and silver in tin single crystals,” Journal of Applied Physics, 37, 1966, 2375–2377.
Y. Kariya, M. Otsuka, “Effect of ismuth on the isothermal fatigue properties of Sn-3.5 mass% Ag solder alloy,” Journal of Electronic Materials, 27(7), 1998, 866–870.
L. Qi, J. Zhao, X. M. Wang, L. Ang, “The effect of Bi on the IMC growth in Sn-3Ag-0.5Cu solder interface during aging process,” International Conference on Business of Electronic Product Reliability and Liability, 2004, 2–46.
C. M. L. Wu, M. L. Huang, “Microstructural evolution of lead-free Sn–Bi–Ag–Cu SMT joints during aging,” IEEE Transactions on Advanced Packaging, 28(1), 2005, 128–133.
K. S. Kim, S. H. Hug, K. Suganuma, “Effect of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu,” Microelectronics Reliability, 43, 2003, 259–267.
P. Sun, C. Andersson, X. Wei, Z. Cheng, D. Shangguan, J. Liu, “Intermetallic compounds formation in Sn–Co–Cu, Sn–Ag.Cu and eutectic Sn–Cu solder joints on electroless Ni(P) surface finish after reflow soldering,” Materials Science and Engineering, B, 135, 2006, 134–140.
S. Dunford, S. Canumalla, P. Viswanadham, “Intermetallic Morphology and Damage Evolution Under Thermomechanical Fatigue of Lead(Pb)-Free Solder Interconnections,” Proc. IEEE Electronic Components and Technology Conference, 2004, 726–736.
K. Norris, A. Landzberg, “Reliability of Controlled Collapse Interconnections,” IBM J. Res. Dev. Interconnection Reliability, 1969, 266–271.
N. Pan, G. Henshall, F. Billaut, S. Dai, M. Strum, R. Lewis, E. Benedetto, J. Rayner, “An acceleration model for Sn–Ag–Cu solder joint reliability under various thermal cycle conditions,” Proc. SMTAI, 2005, 876–883.
O. Salmela, “Acceleration factors for lead-free solder materials,” Transactions of IEEE Components & Packaging Technologies, 30(4), 2007, 700–707.
R. Wassink, M. Verguld, “Manufacturing Techniques for Surface Mounted Assemblies,” Electrochemical Publications LTD, Bristol, England, 1995, 83–85.
J. Hwang, “Environment-Friendly Electronics: Lead-Free Technology,” Electrochemical publications LTD, Bristol, England, 2001, 65–69.
O. Vianco, “Corrosion Issues in Solder Joint Dedsign and Service,” Energy Citations Database, 1999, http://www.osti.gov/energycitations/purl.cover.jsp?purl=/14961-8gkDYa/webviewable/
T. Mattila, P. Marjamðki, J. Kivilahti, “Reliability of CSP Interconnections Under Mechanical Shock Loading Conditions,” IEEE Transactions on Components and Packaging Technologies, 2006, 29(4), 787–795.
A. Prabhu, W. Schaefer, S. Patil, “High Reliability LTCC BGA for Telecom Applications,” Proc. IEEE International Electronics Manufacturing Technology Symposium, 2000, 311–323.
“RIAC Handbook of 217PlusTM Reliability Prediction Models,” Department of Defense, USA, 2006, 145–147.
Author information
Authors and Affiliations
Corresponding author
Exercises
Exercises
-
4.1
Why is there so much concern about lead?
-
4.2
Why is lead (Pb) being phased out? (Motivation)
-
4.3
Is there legislation that bans Pb use in electronics?
-
4.4
What are the advantages of using Pb-free packages? What effort in eliminating lead-containing solders is coming from Europe?
-
4.5
What is the definition of lead-free?
-
4.6
What problems will meet when converting to lead-free?
-
4.7
Which changes will be necessary in customer processes when using lead-free components?
-
4.8
In the reflow process, is there any necessary to modify printing parameters or stencil design for lead-free?
-
4.9
Do higher soldering temperatures have any negative impact on the moisture sensitivity level (MSL)?
-
4.10
Describe the concept of thermomechanical design of electronic packages as an up-front design activity for screening out and minimizing process and reliability-related failures.
-
4.11
Electronic packaging material properties such as the elastic modulus, E(T), yield stress, σ y (T), and coefficient of thermal expansion, CTE(T) are dependent on temperature. How these properties affect the thermomechanical reliability performance of solder joints in electronic assemblies subjected to thermal cycling loading?
Rights and permissions
Copyright information
© 2011 Springer Science+Business Media, LLC
About this chapter
Cite this chapter
Liu, J., Salmela, O., Särkkä, J., Morris, J.E., Tegehall, PE., Andersson, C. (2011). Solder Joint Reliability. In: Reliability of Microtechnology. Springer, New York, NY. https://doi.org/10.1007/978-1-4419-5760-3_4
Download citation
DOI: https://doi.org/10.1007/978-1-4419-5760-3_4
Published:
Publisher Name: Springer, New York, NY
Print ISBN: 978-1-4419-5759-7
Online ISBN: 978-1-4419-5760-3
eBook Packages: EngineeringEngineering (R0)