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Reliability and Quality Management of Microsystem

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Abstract

The ability to design and manufacture microsystems cost-effectively with high reliability and with short time-to-market is crucial for a company’s competitiveness. To avoid delays in product release, it is necessary to focus on minimizing the risk for reliability problems by identifying reliability issues early in the design phase and designing-in features that assure reliability. This requires that failure modes that may be crucial for the reliability must be identified and that measures must be taken to mitigate associated failure mechanisms. Input required for identification of crucial failure mechanisms is data about product requirements, life-cycle conditions, architectures, and manufacturing processes. All involved in the product development process including the end customer must be involved in this work.

When new technologies are implemented, it is the product architecture and processes rather than the end product that shall be qualified. Factors that may affect reliability during production must be identified, and process control must be implemented to assure low variance in the production process.

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References

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Correspondence to Johan Liu .

Exercises

Exercises

  1. 10.1

    Why is the traditional standards-based approach to assure reliability not always relevant to modern microsystems?

  2. 10.2

    Describe the three objectives in IEEE’s standard P1332, Standard Reliability Program for the Development and Production of Electronic Systems and Equipment.

  3. 10.3

    Give examples of loadings during a product’s life cycle that may affect reliability.

  4. 10.4

    How should tests be designed to assess the risks for early failures during a product’s life?

  5. 10.5

    How should tests be designed to assess the risks for failures due to aging and wearout?

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Liu, J., Salmela, O., Särkkä, J., Morris, J.E., Tegehall, PE., Andersson, C. (2011). Reliability and Quality Management of Microsystem. In: Reliability of Microtechnology. Springer, New York, NY. https://doi.org/10.1007/978-1-4419-5760-3_10

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  • DOI: https://doi.org/10.1007/978-1-4419-5760-3_10

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  • Online ISBN: 978-1-4419-5760-3

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