Abstract
The ability to design and manufacture microsystems cost-effectively with high reliability and with short time-to-market is crucial for a company’s competitiveness. To avoid delays in product release, it is necessary to focus on minimizing the risk for reliability problems by identifying reliability issues early in the design phase and designing-in features that assure reliability. This requires that failure modes that may be crucial for the reliability must be identified and that measures must be taken to mitigate associated failure mechanisms. Input required for identification of crucial failure mechanisms is data about product requirements, life-cycle conditions, architectures, and manufacturing processes. All involved in the product development process including the end customer must be involved in this work.
When new technologies are implemented, it is the product architecture and processes rather than the end product that shall be qualified. Factors that may affect reliability during production must be identified, and process control must be implemented to assure low variance in the production process.
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IEEE P1332, Standard Reliability Program for the Development and Production of Electronic Systems and Equipment, IEEE, 1998.
A. Malhotra, A. Strange, L. Condra, I. Knowles, T. Stadterman, J. Boivin, A. Walton and M. Jackson, “Framework for an Objective and Process Based Reliability Program Standard”, Communications in RMSL, 1996, 25–30.
B. McDermott and M. Peterson, “Concurrent Engineering for the New Millennium”, HDI, 4(7), 2001, 20–24.
IPC-T-50F, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, IPC, 1996.
J. Glazer, Reliability of printed circuit assemblies, in C.F. Coombs (Ed.), Printed Circuit Handbook, 4th Edition, McGraw-Hill, New York, 1995, Chapter 37.
IPC-SM-785, Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments, IPC, 1992.
A. Mawer, D. Cho and R. Darveaux, “The Effect of PBGA Solder Pad Geometry on Solder Joint Reliability”, Proc. Surface Mount International, 1996, 127–135.
R. Rörgren, P. E. Tegehall and Carlsson, “Test Methods and Reliability Evaluations of BGA Packages for Automotive Electronics”, Proc. ISHM Nordic, 1997.
P. E. Tegehall and B. Dunn, “Assessment of the Reliability of Solder Joints to Ball and Column Grid Array Packages for Space Applications”, ESA STM-266, ESA Publications Division, Noordwijk, 2001.
P. E. Tegehall, “Reliability Verification of Printed Board Assemblies: A Critical Review of Test Methods and Future Test Strategy”, Proc. Surface Mount International, 1998, 359–382.
JESD 34, Failure-Mechanism-Driven Reliability Qualification of Silicon Devices, JEDEC Solid State Technology Association, 1993.
JESD 94A, Application Specific Qualification Using Knowledge Based Test Methodology, JEDEC Solid State Technology Association, 2008.
F. Wulfert and H. Tiemeyer, “Qualification for Reliability in Time-to-Market Driven Product Creation Processes, Tutorial 2”, Proc. 11th European Symposium on Reliability Of Electronic Devices, Failure Physics and Analysis, Dresden, 2000.
N. C. Noel, The Four Pillars of Wisdom: A System for 21st Century Management, the Swiss Deming Institute, 2000, http://www.deming.ch.
G.K. Hobbs (Ed.), Accelerated Reliability Engineering: HALT and HASS, John Wiley & Sons, Inc., New York, 2000.
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Exercises
Exercises
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10.1
Why is the traditional standards-based approach to assure reliability not always relevant to modern microsystems?
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10.2
Describe the three objectives in IEEE’s standard P1332, Standard Reliability Program for the Development and Production of Electronic Systems and Equipment.
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10.3
Give examples of loadings during a product’s life cycle that may affect reliability.
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10.4
How should tests be designed to assess the risks for early failures during a product’s life?
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10.5
How should tests be designed to assess the risks for failures due to aging and wearout?
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Liu, J., Salmela, O., Särkkä, J., Morris, J.E., Tegehall, PE., Andersson, C. (2011). Reliability and Quality Management of Microsystem. In: Reliability of Microtechnology. Springer, New York, NY. https://doi.org/10.1007/978-1-4419-5760-3_10
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DOI: https://doi.org/10.1007/978-1-4419-5760-3_10
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