Abstract
Moisture sensitivity of microelectronic packages is an area of great concern for the microelectronics industry. The differential swelling of materials in a non-hermetic package during manufacture, handling, storage, and assembly and during its lifetime can cause stresses large enough to damage the package. An automated simulation system (AutoSim) for moisture diffusion and related stress analysis is developed based on ANSYS® Workbench and Excel platform in this chapter. The automated simulation system includes five modules: a Package Model CAD Library, an Executable Wizard System, a Package Material Library, an Environment Options (or Library), and a Report Generation System. It allows users to select the geometry models from CAD library and then perform various moisture-related analyses automatically. This automated simulation system has been applied for moisture diffusion and related stress analysis of an MLP package. Comparison of the results based on the automated simulation system and ANSYS-Multiphysics is presented and discussed in this chapter. A design of experiment (DoE) simulation for epoxy mold compound material examination has been carried out and discussed. The simulation results show that the methodology developed in this chapter provides a high-efficiency solution for package designers and reliability and test engineers who do not have the modeling and the moisture physics background, to find the optimized result much faster than regular method. This may extremely save the design cycle time and the cost for the new product development.
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Acknowledgments
The author thanks the support from the package development and automation development of Fairchild Semiconductor Corporation and the collaboration with Fairchild-ZJUT Joint Lab at Zhejiang University of Technology in China.
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Liu, Y. (2010). Automated Simulation System of Moisture Diffusion and Hygrothermal Stress for Microelectronic Packaging. In: Fan, X., Suhir, E. (eds) Moisture Sensitivity of Plastic Packages of IC Devices. Micro- and Opto-Electronic Materials, Structures, and Systems. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-5719-1_19
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DOI: https://doi.org/10.1007/978-1-4419-5719-1_19
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