Direct Write Technologies

  • Ian Gibson
  • David W. Rosen
  • Brent Stucker


The term “Direct Write” (DW) in its broadest sense can mean any technology which can create two- or three-dimensional functional structures directly onto flat or conformal surfaces in complex shapes, without any tooling or masks [1]. Although beam deposition, direct printing, extrusion-based and other AM processes fit this definition; for the purposes of distinguishing between the technologies discussed in this chapter and the technologies discussed elsewhere in this book, we will limit our definition of DW to those technologies which are designed to build freeform structures in dimensions of 5 mm or less, with feature resolution in one or more dimensions below 50 μm. This “small-scale” interpretation is how the term direct write is typically understood in the additive manufacturing community. Thus, for the purposes of this chapter, DW technologies are those processes which create meso, micro, and nano-scale structures using a freeform deposition tool.


Thermal Spray Additive Manufacturing Direct Write Motion Control System Defense Advance Research Project Agency 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


  1. 1.
    Mortara L, Hughes J, Ramsundar PS, Livesey F, Probert DR (2009) Proposed classification scheme for direct writing technologies. Rapid Prototyping J 15(4):299–309CrossRefGoogle Scholar
  2. 2.
    Abraham MH, Helvajian H (2004) Laser direct write of SiO/sub 2/MEMS and nano-scale devices. Proceedings of SPIE – Volume 5662, Fifth International Symposium on Laser Precision Microfabrication, October 2004, pp 543–550Google Scholar
  3. 3.
    Pique A, Chrisey DB (2001) Direct write technologies for rapid prototyping applications. In: Sensors, electronics and integrated power sources. Academic Press, BostonGoogle Scholar
  4. 4.
    Li B, Dutta Roy T, Clark PA, Church KH (2007) A robust true direct-print technology for tissue engineering. Proceedings of the 2007 International Manufacturing Science and Engineering Conference MSEC2007, October 15-17, 2007, Atlanta, GA, USA paper # MSEC2007-31074, ASMEGoogle Scholar
  5. 5.
  6. 6.
  7. 7.
  8. 8.
    Szczech JB et al (2000) Manufacture of microelectronic circuitry by drop-on-demand dispensing of nanoparticle liquid suspensions. In: Proceedings of the Materials Research Society Symposium, vol 624, p 23Google Scholar
  9. 9.
    Essien M, Renn MJ (2002) Development of mesoscale processes for direct write fabrication of electronic components. In: Keicher D et al (eds) Proceedings of the Conference on Metal powder deposition for rapid prototyping, p 209Google Scholar
  10. 10.
  11. 11.
    Young D, Chrisey DB Issues for tissue engineering by direct-write technologies.]
  12. 12.
    Fitz-Gerald JM et al (2000) Matrix assisted pulsed laser evaporation direct write (MAPLE DW): a new method to rapidly prototype active and passive electronic circuit elements. In: Proceedings of the materials research society symposium, vol 624, p 143Google Scholar
  13. 13.
  14. 14.
    Sampath S et al (2000) Thermal spray techniques for fabrication of meso-electronics and sensors. In: Proceedings of the Materials research society symposium, vol 624, p 181Google Scholar
  15. 15.
  16. 16.
    Chen Q, Longtin JP, Tankiewicz S, Sampath S, Gambino RJ (2004) Ultrafast laser micromachining and patterning of thermal spray multilayers for thermopile fabrication. J Micromech Microeng 14:506–513CrossRefGoogle Scholar
  17. 17.
    Kadekar V, Fang W, Liou F (2004) Deposition technologies For micromanufacturing: a review. J Manuf Sci Eng 126(4):787–795CrossRefGoogle Scholar
  18. 18.
    Duty C, Jean D, Lackey WJ (2001) Laser chemical vapor deposition: materials, modeling, and process control. Int Mater Rev 46(6):271–287CrossRefGoogle Scholar
  19. 19.
    Hoffmann P et al (2000) Focused ion beam induced deposition of gold and rhodium. In: Proceedings of the Materials Research Society Symposium, vol 624, p 171Google Scholar
  20. 20.
    Longo DM, Hull R (2000) Direct focused ion beam writing of printheads for pattern transfer utilizing microcontact printing. In Proceedings of the Materials research society symposium, vol 624, p 157Google Scholar
  21. 21.
    Bhushan B. (2007) Springer handbook of nanotechnology. Springer, New York, p 179CrossRefGoogle Scholar
  22. 22.
    He Z, Zhou JG, Tseng A (2000) Feasibility study of chemical liquid deposition based solid freeform fabrication. J Materials Design 21:83–92CrossRefGoogle Scholar
  23. 23.
    McLeod E, Arnold CB (2008) Laser direct write near-field nanopatterning using optically trapped microspheres. Lasers and Electro-Optics, 2008 and 2008 Conference on Quantum Electronics and Laser Science. CLEO/QELS 2008. 4–9 May 2008Google Scholar
  24. 24.
    Palmer JA et al (2005) Stereolithography: a basis for integrated meso manufacturing. In: Proceedings of the 16th Solid Freeform Fabrication Symposium, Austin, TXGoogle Scholar
  25. 25.
    Church KH et al (2000) Commercial applications and review for direct write technologies. In: Proceedings of the Materials Research Society Symposium, p 624Google Scholar
  26. 26.
    Lewis JA (2006) Direct ink writing of 3D functional materials. Adv Funct Mater 16:2193–2204CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media, LLC 2010

Authors and Affiliations

  • Ian Gibson
    • 1
  • David W. Rosen
    • 2
  • Brent Stucker
    • 3
  1. 1.Department of Mechanical & Production EngineeringNational University of SingaporeSingaporeSingapore
  2. 2.The George W. Woodruff School of Mechanical EngineeringGeorgia Institute of TechnologyAtlantaUSA
  3. 3.Department of Mechanical & Aerospace EngineeringUtah State UniversityLoganUSA

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