Package Construction and Electrical Modeling



The construction of an IC must accomplish many tasks. The first is to electrically connect the signals on the IC to the signal paths on the system PCB. The second is to electrically conduct power from the system PCB to the devices on the IC. In addition, the package must provide mechanical protection for the IC as well as thermal dissipation. The typically consists of two levels of interconnect. The first is the connection from the IC to the package (level 1) and the second is from the package to the system PCB (level 2).


Solder Ball Solder Bump Wire Bond Ball Grid Array Thermal Expansion Mismatch 
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Copyright information

© Springer Science+Business Media, LLC 2010

Authors and Affiliations

  • Chunjie Duan
    • 1
  • Brock J. LaMeres
    • 2
  • Sunil P. Khatri
    • 3
  1. 1.Mitsubishi Electric Research Laboratories (MERL)CambridgeUSA
  2. 2.Dept. Electrical & Computer EngineeringMontana State UniversityBozemanUSA
  3. 3.Dept. Electrical & Computer EngineeringTexas A & M UniversityCollege StationUSA

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