Optimal Bus Sizing

  • Chunjie Duan
  • Brock J. LaMeres
  • Sunil P. Khatri


The use of advanced packaging will reduce the electrical parasitics due to the package. This reduces the package noise in the system which leads to increased performance; however, moving toward advanced packaging is often more expensive and can result in a cost prohibitive increase in the majority of modern VLSI designs.


Ball Grid Array Lead Frame Throughput Requirement Advanced Packaging Good Electrical Performance 
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Copyright information

© Springer Science+Business Media, LLC 2010

Authors and Affiliations

  • Chunjie Duan
    • 1
  • Brock J. LaMeres
    • 2
  • Sunil P. Khatri
    • 3
  1. 1.Mitsubishi Electric Research Laboratories (MERL)CambridgeUSA
  2. 2.Dept. Electrical & Computer EngineeringMontana State UniversityBozemanUSA
  3. 3.Dept. Electrical & Computer EngineeringTexas A & M UniversityCollege StationUSA

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