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Optimal Bus Sizing

  • Chunjie Duan
  • Brock J. LaMeres
  • Sunil P. Khatri
Chapter

Abstract

The use of advanced packaging will reduce the electrical parasitics due to the package. This reduces the package noise in the system which leads to increased performance; however, moving toward advanced packaging is often more expensive and can result in a cost prohibitive increase in the majority of modern VLSI designs.

Keywords

Ball Grid Array Lead Frame Throughput Requirement Advanced Packaging Good Electrical Performance 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media, LLC 2010

Authors and Affiliations

  • Chunjie Duan
    • 1
  • Brock J. LaMeres
    • 2
  • Sunil P. Khatri
    • 3
  1. 1.Mitsubishi Electric Research Laboratories (MERL)CambridgeUSA
  2. 2.Dept. Electrical & Computer EngineeringMontana State UniversityBozemanUSA
  3. 3.Dept. Electrical & Computer EngineeringTexas A & M UniversityCollege StationUSA

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