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Power Issues During Test

  • Sandip Kundu
  • Alodeep Sanyal
Chapter

Abstract

An unintended consequence of technology scaling has increased power consumption in a chip. Without specialized solutions, level of power consumption and rate of change of power consumption is even greater during test. Power delivery during test is somewhat limited by mechanical and electrical constraints. This chapter introduces the basic concepts related to power and energy and describes typical manufacturing test flow and associated constraints with power delivery. It also describes various types of power droop mechanisms, thermal issues, and how they interfere with the test process. Test economics issues, such as throughput and yield loss, are also discussed to further develop the low-power test problem statement.

Keywords

Complementary Metal Oxide Semiconductor Power Delivery Voltage Droop Automatic Test Pattern Generation Power Distribution Network 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media, LLC 2010

Authors and Affiliations

  1. 1.University of MassachusettsAmherstUSA

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