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Nano-Bio- Electronic, Photonic and MEMS Packaging pp 349–429Cite as

On-Chip Thermal Management and Hot-Spot Remediation

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Abstract

The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in die heat flux and growing concern over the emergence of on-chip “hot spots.” The application of on-chip high heat flux cooling techniques provides a viable direction for the thermal management of such nanoelectronic components. Following a review of the relevant passive and active thermal management techniques, the physical phenomena underpinning the most promising on-chip thermal management approaches are described. Attention is devoted to thin-film and miniaturized thermoelectric coolers, orthotropic TIMs/heat spreaders, and phase-change microgap coolers for hot-spot remediation and thermal management of these nanoelectronic chips.

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Authors and Affiliations

  1. Department of Mechanical Engineering, University of Maryland, College Park, MD, USA

    Avram Bar-Cohen & Peng Wang

Authors
  1. Avram Bar-Cohen
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  2. Peng Wang
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Correspondence to Avram Bar-Cohen .

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Editors and Affiliations

  1. School of Materials Science &, Georgia Institute of Technology, Ferst Drive NW., 771, Atlanta, 30332-0245, U.S.A.

    C.P. Wong

  2. School of Materials Science &, Georgia Institute of Technology, Ferst Drive NW., 771, Atlanta, 30332-0245, U.S.A.

    Kyoung-Sik Moon

  3. CH5-159, Intel Corporation, W. Chandler Blvd. 5000, Chandler, 85226, U.S.A.

    Yi (Grace) Li

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Bar-Cohen, A., Wang, P. (2010). On-Chip Thermal Management and Hot-Spot Remediation. In: Wong, C., Moon, KS., Li, Y. (eds) Nano-Bio- Electronic, Photonic and MEMS Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4419-0040-1_12

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