The explosive demand in wireless-capable devices, especially with the proliferation of multiple standards, indicates a great opportunity for adoption of wireless technology at a mass-market level. The communication devices of both today and the future will have not only to allow for a variety of applications, supporting the transfer of characters, audio, graphics, and video data, but they will also have to maintain connection in a variety of environments with many other devices rather than with a single base station. Moreover, to provide various services from different wireless communication standards with higher capacities and higher data-rates, fully integrated and multifunctional wireless devices will be required.
Multifunctional circuits and systems can be made profitable by a large scale of integration, elimination of external components, reduction of silicon area, and extensive reuse of resources. Integration of (Bi)CMOS transceiver RF front-end and analog baseband circuits with computing CMOS circuits on the same silicon chip further reduces costs of multifunctional mobile devices.
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© 2009 Springer Science+Business Media B.V.
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(2009). Introduction. In: Tasić, A., Serdijn, W.A., Larson, L.E., Setti, G. (eds) Circuits and Systems for Future Generations of Wireless Communications. Series on Integrated Circuits and Systems. Springer, Dordrecht. https://doi.org/10.1007/978-1-4020-9917-5_1
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DOI: https://doi.org/10.1007/978-1-4020-9917-5_1
Publisher Name: Springer, Dordrecht
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Online ISBN: 978-1-4020-9917-5
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