Abstract
Due to the consideration of environmental protection policy, all electronic products are requested to be lead free, In package field, solder ball is also requested to be lead free and currently the most popular type of solder ball is the Sn/Ag/Cu solder[l]. Sn/Ag/Cu solder has higher melting point and narrower control window of re-flow profile than eutectic solder ( Sn/Pb )[2], therefore the strength of solder joint of Sn/Ag/Cu solder has risk to be worse than Sn/Pb Solder.
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References
Karl J. Puttlitz and Kathleen A. Stalter, “Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. 5. Market, Product, and Corporate Policy Trends,” IBM Corporation, 149–165(2004).
Karl J. Puttlitz and Kathleen A. Stalter, “Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. 8. Sn-Ag and Sn-Ag-X Solders and Properties,” IBM Corporation, 239–280(2004).
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Chien, CH., Tseng, CC., Chen, T. (2007). The Effects of Internal Stressrs in Bga Ni Layer on the Strength of Sn/Ag/Cu Solder Joint. In: Gdoutos, E.E. (eds) Experimental Analysis of Nano and Engineering Materials and Structures. Springer, Dordrecht. https://doi.org/10.1007/978-1-4020-6239-1_440
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DOI: https://doi.org/10.1007/978-1-4020-6239-1_440
Publisher Name: Springer, Dordrecht
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