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The Effects of Internal Stressrs in Bga Ni Layer on the Strength of Sn/Ag/Cu Solder Joint

  • Chi-Hui Chien
  • Chi-Chao Tseng
  • Thaiping Chen
Conference paper

Abstract

Due to the consideration of environmental protection policy, all electronic products are requested to be lead free, In package field, solder ball is also requested to be lead free and currently the most popular type of solder ball is the Sn/Ag/Cu solder[l]. Sn/Ag/Cu solder has higher melting point and narrower control window of re-flow profile than eutectic solder ( Sn/Pb )[2], therefore the strength of solder joint of Sn/Ag/Cu solder has risk to be worse than Sn/Pb Solder.

Keywords

Solder Joint Internal Stress Solder Ball Drop Test Eutectic Solder 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

References

  1. 1.
    Karl J. Puttlitz and Kathleen A. Stalter, “Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. 5. Market, Product, and Corporate Policy Trends,” IBM Corporation, 149–165(2004).Google Scholar
  2. 2.
    Karl J. Puttlitz and Kathleen A. Stalter, “Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. 8. Sn-Ag and Sn-Ag-X Solders and Properties,” IBM Corporation, 239–280(2004).Google Scholar

Copyright information

© Springer 2007

Authors and Affiliations

  • Chi-Hui Chien
    • 1
  • Chi-Chao Tseng
    • 1
    • 2
  • Thaiping Chen
    • 1
    • 3
  1. 1.Department of Mechanical and Electro-Mechanical EngineeringNational Sun Yat-Sen UniversityKaohsiung 80424Taiwan
  2. 2.BGA R&D Group, ASE GROUPKaohsiung 80424Taiwan
  3. 3.Department of Electrical EngineeringFortune Institute of TechnologyKaohsiung 84241Taiwan

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