Abstract
The cost of each design cycle increases as the fabrication process technology advances. As such, new techniques are required to minimize the number of spins required before a chip meets all of its specifications. This chapter presents the motivation behind and requirements for what is termed “first pass silicon success” in the context of designing complex RF integrated transcivers for wireless applications. Design techniques leading to first pass success and taking advantage of the increased integration of digital, analog and RF are presented that address these issues.
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Wilson, J., Ismail, M. (2006). RFIC DESIGN FOR FIRST-PASS SILICON SUCCESS. In: ISMAIL, M., GONZÁLEZ, D.R. (eds) Radio Design in Nanometer Technologies. Springer, Dordrecht. https://doi.org/10.1007/978-1-4020-4824-1_13
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DOI: https://doi.org/10.1007/978-1-4020-4824-1_13
Publisher Name: Springer, Dordrecht
Print ISBN: 978-1-4020-4823-4
Online ISBN: 978-1-4020-4824-1
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