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An Array Implementation of the Resonance Spectroscopy Method for Adhesive Bonding Imaging

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Acoustical Imaging

Part of the book series: Acoustical Imaging ((ACIM,volume 27))

Abstract

This work presents a theoretical analyses and experimental study of an imaging technique for the quality control of adhesive bonding. A typical problem with using standard time domain based imaging (C-scans) lies in the acoustic mismatch between the metal and the adhesive. This means that much of the pulse is reflected from the fiirst interface and “rings” in the upper sheet. Little energy is passed into the adhesive; even less makes its way back from the second interface to the transducer.

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References

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© 2004 Springer Science+Business Media Dordrecht

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O’neill, B., Maev, R.G., Severin, F., Titov, S. (2004). An Array Implementation of the Resonance Spectroscopy Method for Adhesive Bonding Imaging. In: Arnold, W., Hirsekorn, S. (eds) Acoustical Imaging. Acoustical Imaging, vol 27. Springer, Dordrecht. https://doi.org/10.1007/978-1-4020-2402-3_24

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  • DOI: https://doi.org/10.1007/978-1-4020-2402-3_24

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-90-481-6652-7

  • Online ISBN: 978-1-4020-2402-3

  • eBook Packages: Springer Book Archive

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