Abstract
Interaction between a moving dislocation and localized obstacles determines microstructure-induced hardening. The mechanisms and parameters of such interactions are necessary inputs to large scale dislocation dynamics modelling. We have developed a model to investigate these characteristics at the atomic level for dislocation-obstacle interactions under both static (T=OK) and dynamic (T>OK) conditions. We present results on hardening due to pinning of edge dislocations at obstacles such as voids, coherent precipitates and stacking fault tetrahedra in bcc-iron and fcc-copper at temperatures from 0 to 600K. It is demonstrated that atornic-scale simulation is required to determine the effects of stress, strain rate and temperature and that such effects cannot always be rationalized within continuum theory.
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Osetsky, Y.N., Bacon, D.J. (2004). Atomic-Level Interaction of an Edge Dislocation with Localized Obstacles in Fcc and Bcc Metals. In: Kitagawa, H., Shibutani, Y. (eds) IUTAM Symposium on Mesoscopic Dynamics of Fracture Process and Materials Strength. Solid Mechanics and its Applications, vol 115. Springer, Dordrecht. https://doi.org/10.1007/978-1-4020-2111-4_19
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DOI: https://doi.org/10.1007/978-1-4020-2111-4_19
Publisher Name: Springer, Dordrecht
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