Abstract
A high-power SMD-LED (HL-LED) outline (3.2 x 2.8 mm2) was developed, with a chip-size up to 1.4 mm2 and power dissipation up to 1500 mW (at 400 mA for UV-InGaN) in a corresponding thermal ambient. The thermal resistance is 12 K/W. For high-integration applications (spotlights, general lighting), special PCBs with isolating layers thinner than 10 µm (commercial solutions: 150µm) were developed also. Modules on 1 mm copper (area 40 x 40 mm2) with 100 HL-LEDs, P rot = 50 W, P opr = 8 W in amber (595 nm) and with thermal resistance of 6 K/W were demonstrated.
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© 2004 Springer Science+Business Media Dordrecht
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Mahlkow, A. (2004). High Power LED and Thermal Management. In: Shur, M.S., Žukauskas, A. (eds) UV Solid-State Light Emitters and Detectors. NATO Science Series, vol 144. Springer, Dordrecht. https://doi.org/10.1007/978-1-4020-2103-9_21
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DOI: https://doi.org/10.1007/978-1-4020-2103-9_21
Publisher Name: Springer, Dordrecht
Print ISBN: 978-1-4020-2035-3
Online ISBN: 978-1-4020-2103-9
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