Photoetching and Screen-Printing Conductor Patterns
The development of a microwave hybrid integrated circuit capability is built around the necessity for obtaining and controlling conductor geometries to fine tolerances (fractions of a millimetre). The new discrete devices which are becoming available, such as flip-chip devices, and beam-lead devices, require not only the fine tolerances but also fine lines in the range of 0.050–0.127 mm line widths and line spaces.
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