Abstract
This chapter describes the polymeric materials that may be used as adhesives in the industry and as successful application is inextricably paired with the bonding process this aspect too will be discussed. Adhesives are used when making components, enclosures and peripheral equipment and the forces of adhesion are also employed when making laminates, impregnating resins, encapsulating and moulding compositions. This second group of topics are dealt with elsewhere in the book and so need not be discussed in detail here. There are bonding processes that use no adhesive. These in the case of joining metals shade into welding techniques so discussion here is brief.
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Bibliography
Adhesives Handbook, J Shields. (Butterworths, London 1970 ).
Metal to Metal Adhesive Bonding, Semerdjiev, (Business Books, London 1970 ).
Adhesion and Adhesives Vol II ed R Houwink and G Salmon. (Elsevier, London 1967 ).
Adhesives Directory 1970, (AS O’Connor Surrey, 1970
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© 1971 Palgrave Macmillan, a division of Macmillan Publishers Limited
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Garnish, E.W. (1971). Adhesives & Bonding. In: Waller, W.F. (eds) Electronics Design Materials. Macmillan Engineering Evaluations. Palgrave Macmillan, London. https://doi.org/10.1007/978-1-349-01176-6_22
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DOI: https://doi.org/10.1007/978-1-349-01176-6_22
Publisher Name: Palgrave Macmillan, London
Print ISBN: 978-1-349-01178-0
Online ISBN: 978-1-349-01176-6
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