Film Circuits

  • H. Pamplin
Part of the Macmillan Engineering Evaluations book series (MECS)

Abstract

Film circuitry may be divided into two main technologies; thick films which are fabricated by the action of screen printing and firing resistor, conductor and dielectric pastes, onto alumina substrates, and thin films which are fabricated by the vacuum deposition of metals onto glass or aluminium substrates.

Keywords

Furnace Microwave Chromium Epoxy Boiling 

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. 1.
    J R Rairden. Thick and Thin Films for Electronic Applications—Material and Process Review. Solid State Technology, January 1970.Google Scholar
  2. 2.
    L Keys and F Herring. Fabrication of Multilayer Thick Film Microelectronic Circuits. ISHM Symposium Proceedings 1970.Google Scholar
  3. 3.
    L Holland. Vacuum Deposition of Thin Films.Google Scholar
  4. 4.
    R Picton and J Hindrick. High Speed Laser Trimming of Thick Film Resistors. ISHM Symposium Proceedings 1970.Google Scholar
  5. 5.
    D Boswell and R F Russell. Thick and Thin Film Resisto rs: Performance and Reliability Comparisons. Microelectronics, Vol I, Number I, Autumn 1970.Google Scholar
  6. 6.
    R F Baxter. Pick the Right Hybrid Technique. Electronic Design 6, March 15, 1967.Google Scholar
  7. 7.
    L Keys, F Francis and A Russo. Bonding Conditions and Tests and Fine Line Technology for Attaching Beam-Lead Devices to Hybrid Integrated Circuits. ISHM Symposium Proceedings 1970.Google Scholar
  8. 8.
    P Lin, J Lee and S Im. Design Considerations for Flip-Chip Joining Technique. Solid State Technology, July 1970.Google Scholar

Copyright information

© Palgrave Macmillan, a division of Macmillan Publishers Limited 1971

Authors and Affiliations

  • H. Pamplin
    • 1
  1. 1.The Plessey Company Limited Electronics GroupUK

Personalised recommendations