Abstract
This chapter reviews materials and processing for fabricating organic substrates including laminate substrates for plastic BGA (PBGA), build-up substrates for flip chip BGA (FCBGA), tape substrate for tape BGA (TBGA), coreless substrate, and some specialty substrates such as substrates for RF modules, high performance substrates with low dielectric constant, and substrate with embedded components (active dies or passives). Future trend of organic substrate development is also covered in this chapter.
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Notes
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1 Reprint Courtesy of Advanced Semiconductor Engineering Inc.
- 2.
2 Reprint Courtesy of Advanced Semiconductor Engineering Inc.
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3 Reprint Courtesy of Showa Denko K.K.
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4 Reprint Courtesy of Advanced Semiconductor Engineering Inc.
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5 Reprint Courtesy of International Business Machines Corporation, copyright 2000 ?c International Business Machines Corporation
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6 Reprint Courtesy of Advanced Semiconductor Engineering Inc.
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Appelt, B. (2009). Advanced Substrates: A Materials and Processing Perspective. In: Lu, D., Wong, C. (eds) Materials for Advanced Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-78219-5_7
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DOI: https://doi.org/10.1007/978-0-387-78219-5_7
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-387-78218-8
Online ISBN: 978-0-387-78219-5
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