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Abstract

Thin silicon die production is becoming a challenge for all spheres of semiconductor industry. The diversity of requirements and constraints for various applications leads to a lot of different solutions for making thin dies. This chapter describes recent developments on silicon wafer thinning and singulation. Various technologies for material removal and the associated damage caused by the material removal are reviewed in details. Different surface treatment approaches and their effect on improving mechanical property of thinned silicon are also discussed in this chapter.

Keywords

Thinning Grinding Back side treatment Wafer-bow Damage Singulation Laser Mechanical Performance 

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Copyright information

© Springer Science+Business Media, LLC 2009

Authors and Affiliations

  1. 1.Dipl. Phys. Univ., IFAG OP FEP T UPD 5 Infineon Technologies AGGermany

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