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Advanced Bonding/Joining Techniques

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Materials for Advanced Packaging

Abstract

In this chapter, three advanced bonding/joining techniques, adhesive bonding, direct bonding, and lead-free soldering, are presented. For each technique, we first review the bonding principles and applications in electronic industries, followed by novel bonding materials and processes.

For adhesive bonding, four popular adhesives, epoxy resins, silicon resins, polymides, and acrylics, are reviewed. Two new adhesives, liquid crystal polymer (LCP) and SU8, are covered too. LCP has the properties of both polymers and liquid crystals. It, thus, can be bonded to silicon, metal, and glass, and used as flexible circuit board. SU 8, an epoxy-based negative type photoresist, has been applied to zero-level-packaging technology for low-cost wafer-level MEMS packaging.

For direct bonding, three popular methods, anodic bonding, diffusion bonding, and surface-activated bonding, are discussed. Anodic bonding process has extensive applications in silicon-glass bonding and glass-glass bonding. Diffusion bonding process forms chemical bonds by inter-diffusion of two different atoms over the bond line. Surface-activated bonding is valuable in bonding objects with large difference in coefficients of thermal expansion because of low process temperature, usually room temperature. A novel Ag-to-Cu direct bonding technique at bonding temperature of 250°C is reported.

In lead-free soldering, fundamental soldering principle is presented. To eliminate the use of fluxes, oxidation-free fluxless soldering technology has been developed. It has been applied to developing numerous soldering processes based on systems such as Sn-Au, Sn-Cu, Sn-Ag, In-Au, In-Cu, and In-Ag. Two fluxless processes are reported. One is bonding between Si/Cr/Au/Sn/Ag and Si/Cr/Au. The other is between Si/Cr/Au/Ag and Cu/Ag/In/Ag. In either process, high bonding quality is achieved without using any flux. Fluxless process has also been demonstrated in flip-chip configuration using Sn-rich solder joints.

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Authors and Affiliations

  1. Electrical Engineering and Computer Science, University of California, Irvine, 2226 Engineering Gateway Building, Irvine, CA 92697-2660

    Chin C. Lee

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  1. Chin C. Lee
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  2. Pin J. Wang
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  3. Jong S. Kim
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Correspondence to Chin C. Lee .

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Editors and Affiliations

  1. Henkel Locite Co., Ltd. Yantai, Shandong, P.R., China

    Daniel Lu

  2. Georgia Institute of Technology, Atlanta, GA, USA

    C.P. Wong

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Lee, C.C., Wang, P.J., Kim, J.S. (2009). Advanced Bonding/Joining Techniques. In: Lu, D., Wong, C. (eds) Materials for Advanced Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-78219-5_2

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