Electrically Conductive Adhesives (ECAs)

Abstract

Recently, significant advances have been made to improve electrically conductive adhesive (ECA) technology. Recent material development of various anisotropic conductive adhesives/films (ACAs/ACFs) and their applications are reviewed first and then recent research achievements in material development and in both electrical and mechanical aspects of isotropic conductive adhesives (ICAs) including electrical conductivity improvement, contact resistance mechanism elucidation and approaches to stabilize the contact resistance, and mechanical impact performance enhancement are reviewed in details.

Keywords

Electrically conductive adhesives (ECAs) ICAs ACAs/ACFs Conductivity Conductive particles Contact resistance Corrosion inhibitor Impact performance Lead-free Flip chip Chip scale package (CSP) Ball grid array (BGA) Surface mount technology (SMT) 

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Copyright information

© Springer Science+Business Media, LLC 2009

Authors and Affiliations

  1. 1.Intel Corporation, Henkel Corporation, Henkel Loctite (China) Co., Ltd.Yantai ETDZChina 264006,Chandler, AZ

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