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Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips

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Materials for Advanced Packaging

Abstract

Epoxy molding compounds (EMCs) have been used extensively as an encapsulation and protection material for semiconductor packages and must meet ever-evolving packaging requirements including moisture sensitivity level (MSL), moldability, and environmental and other reliability 1000 requirements. This chapter provides an overview of most recent development on various aspects of EMCs including advanced material development, molding process, and approaches to improve moldability, moisturized reflow resistance, warpage control of molded area array packages, and stress management for molding die with low-k interlayer dielectrics (ILD).

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Author information

Authors and Affiliations

  1. Information and Telecommunication Materials Laboratories (ITML), Electronic Device Materials Research Laboratory 1, Sumitomo Bakelite Co., Ltd., 20-7, Kiyohara Industrial Park Utsunomiya-city Tochigi prefecture, 321-3231 Japan

    Shinji Komori

Authors
  1. Shinji Komori
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  2. Yushi Sakamoto
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Editor information

Editors and Affiliations

  1. Henkel Locite Co., Ltd. Yantai, Shandong, P.R., China

    Daniel Lu

  2. Georgia Institute of Technology, Atlanta, GA, USA

    C.P. Wong

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Komori, S., Sakamoto, Y. (2009). Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips. In: Lu, D., Wong, C. (eds) Materials for Advanced Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-78219-5_10

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