Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips

  • Shinji Komori
  • Yushi Sakamoto


Epoxy molding compounds (EMCs) have been used extensively as an encapsulation and protection material for semiconductor packages and must meet ever-evolving packaging requirements including moisture sensitivity level (MSL), moldability, and environmental and other reliability 1000 requirements. This chapter provides an overview of most recent development on various aspects of EMCs including advanced material development, molding process, and approaches to improve moldability, moisturized reflow resistance, warpage control of molded area array packages, and stress management for molding die with low-k interlayer dielectrics (ILD).


Epoxy molding compounds (EMCs) Flame retardant Moldability Moisturized reflow resistance Warpage Low-k ILD 


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Copyright information

© Springer Science+Business Media, LLC 2009

Authors and Affiliations

  • Shinji Komori
    • 1
  • Yushi Sakamoto
  1. 1.Information and Telecommunication Materials Laboratories (ITML)Electronic Device Materials Research Laboratory 1, Sumitomo Bakelite Co., Ltd., 20-7, Kiyohara Industrial Park Utsunomiya-city Tochigi prefecture321-3231 Japan

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