Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips

  • Shinji Komori
  • Yushi Sakamoto

Abstract

Epoxy molding compounds (EMCs) have been used extensively as an encapsulation and protection material for semiconductor packages and must meet ever-evolving packaging requirements including moisture sensitivity level (MSL), moldability, and environmental and other reliability 1000 requirements. This chapter provides an overview of most recent development on various aspects of EMCs including advanced material development, molding process, and approaches to improve moldability, moisturized reflow resistance, warpage control of molded area array packages, and stress management for molding die with low-k interlayer dielectrics (ILD).

Keywords

Epoxy molding compounds (EMCs) Flame retardant Moldability Moisturized reflow resistance Warpage Low-k ILD 

References

  1. 1.
    Kazuo TAKAHASHI, Kogyo Zairyo, 42, 112 (1994)Google Scholar
  2. 2.
    Hiroyuki HOZOJI, Osamu HORIE, Shoji OGATA, Shunichi NUMATA, and Tokuyuki KINJO, Japanese Journal of Polymer Science and Technology, 47, 483 (1990)Google Scholar
  3. 3.
    The Society of Powder Technology, Japan Ed., “Comminution, Classification and Surface Modification”, p. 566, N.G.T. (2001)Google Scholar
  4. 4.
    Akinobu KUSUHARA, Masumi SAKA, and Toshitsune ISHIGURO, Journal of the Adhesion Society of Japan, 35, 153 (1999)Google Scholar
  5. 5.
    M. IJI and Y. KIUCHI, Polym. Adv. Tchnol., 12, 393 (2001)CrossRefGoogle Scholar
  6. 6.
    Masatoshi IJI, Yukihiro KIUCHI, Isao KATAYAMA, and Takayuki UNO, Electronic Materials, 2000, April, 86 (2000)Google Scholar
  7. 7.
    Yushi SAKAMOTO and Hiroki OSUGA, Electronics Mounting Technology, 18, 44 (2002)Google Scholar
  8. 8.
    Semiconductor and Integrated Circuits Division, Hitachi, Ltd. Ed., “Mounting Technology of Surface Mounted LSI Packages and Improvement of the Reliability Thereof” p. 502, Oyo Gijutsu Shuppan (1989)Google Scholar
  9. 9.
    Naotaka NAKA, Makoto KITANO, Tetsuo KUMAZAWA, and Asao NISHIMURA, Journal of Japan Society Mechanical Engineers, 63, 614 (1997)Google Scholar
  10. 10.
    Ken OOTA, Masumi SAKA, J. Polym. Eng. Sci., 41, 1373 (2001)Google Scholar

Copyright information

© Springer Science+Business Media, LLC 2009

Authors and Affiliations

  • Shinji Komori
    • 1
  • Yushi Sakamoto
  1. 1.Information and Telecommunication Materials Laboratories (ITML)Electronic Device Materials Research Laboratory 1, Sumitomo Bakelite Co., Ltd., 20-7, Kiyohara Industrial Park Utsunomiya-city Tochigi prefecture321-3231 Japan

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