3D Integration Technologies – An Overview

Abstract

The next generation of integrated micro-system technologies can only keep up with increased functionality and performance demands by using the 3rd dimension. The primary drivers for 3D integration are miniaturization, integration of different technologies in a small form-factor, and performance. 3D integration technologies can be grouped into 3 main categories, namely 3D On-chip integration, 3D IC-stacking, and 3D-packaging. This chapter provides a detailed review of each of these categories.

Keywords

Micro-system 3D integration Die stacking Thru-silicon vias (TSVs) Wafer bonding 

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Copyright information

© Springer Science+Business Media, LLC 2009

Authors and Affiliations

  1. 1.Sandia National LaboratoriesAlbuquerque

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