Keywords
- Active Layer
- Power Dissipation
- Leakage Power
- Thermal Interface Material
- Alternate Direction Implicit Method
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
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Lin, SC., Banerjee, K. (2008). Thermal Challenges of 3D ICs. In: Tan, C., Gutmann, R., Reif, L. (eds) Wafer Level 3-D ICs Process Technology. Integrated Circuits and Systems. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-76534-1_14
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