Skip to main content
  • 1279 Accesses

Methodologies for ASIC design have been seen as lagging behind custom design methodologies for a long time. With process migration to 90nm and below, ASIC design methodologies are fast catching up with custom design methodologies.

An economic driver for ASICs is the increasing demand for mobile and consumer devices. These devices have smaller form factors. They are becoming part of everyday life with high usage, and need to be robust. For example, a device that combines cellular telephony with a PDA is used many times during the day without recharging. This is forcing designers to look at power as an important metric when they design chips for these devices. Such low power designs are becoming more and more commonplace.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 89.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 119.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 169.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

Download references

Author information

Authors and Affiliations

Authors

Rights and permissions

Reprints and permissions

Copyright information

© 2007 Springer Science+Business Media, LLC

About this chapter

Cite this chapter

Kuo, G., Iyer, A. (2007). Low Power ARM 1136JF-S Design. In: Closing the Power Gap Between ASIC & Custom. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-68953-1_14

Download citation

  • DOI: https://doi.org/10.1007/978-0-387-68953-1_14

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-0-387-25763-1

  • Online ISBN: 978-0-387-68953-1

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics