Physical vapor deposition refers to vacuum deposition methods that produce the source gas by evaporation, sputtering, or a related nonchemical method. Broadly, these methods transfer kinetic energy to atoms in a solid or liquid sufficient to overcome their binding energy. Evaporation refers to heating a material until the source atoms vaporize. Sputtering is a process of physical impacts transferring kinetic energy to atoms in a target. There are many related methods such as laser-ablation, which is similar to conventional evaporation but supplies energy to the surface locally by a laser beam rather than heating the entire material in an oven. Likewise, cathodic arc deposition is a sputtering-based process that uses a more localized, higher intensity glow discharge to bombard the target in a small region, rather than “sputtering” which refers to a more general bombardment of the target. This chapter describes the most common conventional evaporation and sputtering methods. Descriptions of the related techniques may be found in the recommended readings.
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(2008). Physical Vapor Deposition. In: The Materials Science of Semiconductors. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-68650-9_11
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