Abstract
As integrated circuit (IC) technology continues to advance, there will be increasing demands on I/O counts and power requirements, leading to decreasing solder pitch and increasing current density for solder balls in high-density wafer-level packages [1]. As the electronics industry continues to push for miniaturization, reliability becomes a vital issue. The demand for more and smaller solder bumps, while increasing the current, has also resulted in a significant increase in current density [2], which can cause the failure of solder interconnects due to electromigration [3].
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Kumar, K.M., Kripesh, V., Tay, A.A.O. (2008). Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced With Single-Wall Carbon Nanotubes. In: Morris, J. (eds) Nanopackaging. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-47325-3_19
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