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Cooling and Packaging of High-Power Diode Lasers

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High-Power Diode Lasers

Part of the book series: Topics in Applied Physics ((TAP,volume 78))

Abstract

An overview of cooling and packaging of high-power diode lasers is given. The discussion concentrates on diode lasers in bar geometry, typically 10 mm-wide, which are soldered on actively cooled micro-channel heat sinks, made from copper.

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References

  1. R. Beach, W. J. Benett, B. L. Freitas, D. Mundinger, B. J. Comaskey, R. W. Solarz, M. A. Emanuel: Modular microchannel-cooled heat sink for high average power laser-diode array, IEEE J. QE 28, 966–976 (1992)

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  2. Verein Deutscher Ingenieure (ed.): VDI-Wärmeatlas (VDI, Düsseldorf 1984)

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  3. T. Ebert: Optimierung von Mikrokanalkühlern zur Steigerung der Ausgangsleistung von Hochleistungs-Diodenlasern, Dissertation RWTH Aachen, Aachen (1999)

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  4. T. Ebert, G. Treusch, P. Loosen, R. Poprawe: Photonics West 98, SPIE Proc. 3285, 25–29 (1998)

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  5. J. Jandeleit, N. Wiedmann, P. Loosen, R. Poprawe: Photonics West 99, SPIE Proc. 3626, 217–221 (1999)

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Authors and Affiliations

  1. Fraunhofer-Institut für Lasertechnik, Steinbachstrasse 15, D-52074, Aachen, Germany

    Peter Loosen

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  1. Peter Loosen
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Editor information

Editors and Affiliations

  1. Fraunhofer-Institut für Angewandte Festkörperphysik, Tullastrasse 72, 79108, Freiburg, Germany

    Roland Diehl

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© 2000 Springer-Verlag Berlin Heidelberg

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Loosen, P. (2000). Cooling and Packaging of High-Power Diode Lasers. In: Diehl, R. (eds) High-Power Diode Lasers. Topics in Applied Physics, vol 78. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-47852-3_8

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  • DOI: https://doi.org/10.1007/3-540-47852-3_8

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  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-66693-6

  • Online ISBN: 978-3-540-47852-2

  • eBook Packages: Springer Book Archive

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