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International Workshop on Software Product-Family Engineering

PFE 2001: Software Product-Family Engineering pp 346–352Cite as

Measuring Product Line Architectures

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Part of the book series: Lecture Notes in Computer Science ((LNCS,volume 2290))

Abstract

Software application families and their accompanying architectures (also referred to as product line architectures or PLAs) are a promising area in which the potential of software component reuse can be fully realized. Evolving such application families necessitates making informed architectural decisions. Among industry and research communities, it is recognized that software metrics can provide guidance during the making of such decisions. In this paper, we introduce metrics that are specifically geared to assess product line architectures and help in maintaining their quality.

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References

  1. A. van der Hoek, M. Rakic, R. Roshandel, and N. Medvidovic. Taming Architectural Evolution. ESEC/FSE 2001, Vienna, September 2001.

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Author information

Authors and Affiliations

  1. Computer Science Department, University of Southern California, 90089-0781, Los Angeles, CA, USA

    Ebru Dincel & Nenad Medvidovic

  2. Institute for Software Research, University of California, Irvine, 92697-3425, Irvine, CA, USA

    André van der Hoek

Authors
  1. Ebru Dincel
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  2. Nenad Medvidovic
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  3. André van der Hoek
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Editor information

Editors and Affiliations

  1. Philips Medical Systems Nederland B.V., Veenpluis 4-6, 5684, PC Best, The Netherlands

    Frank van der Linden

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© 2002 Springer-Verlag Berlin Heidelberg

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Cite this paper

Dincel, E., Medvidovic, N., van der Hoek, A. (2002). Measuring Product Line Architectures. In: van der Linden, F. (eds) Software Product-Family Engineering. PFE 2001. Lecture Notes in Computer Science, vol 2290. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-47833-7_31

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  • DOI: https://doi.org/10.1007/3-540-47833-7_31

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  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-43659-1

  • Online ISBN: 978-3-540-47833-1

  • eBook Packages: Springer Book Archive

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