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Three-Dimensional CMOS Image Sensor for Pedestrian Protection and Collision Mitigation

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Advanced Microsystems for Automotive Applications 2006

Part of the book series: VDI-Buch ((VDI-BUCH))

Abstract

Future car safety systems increasingly depend on the availability of robust sensors with vital improved technical perception output. For this objective, we develop a pulsed laser based time of flight range sensor in fully solid-state microsystems technology for more reliable detection and classification of road users, vehicles and traffic obstacles. The development aims on pedestrian protection and mitigation of collisions comprising the short distance around vehicle perception up to 25 m. The 3D sensor technology based on a chip design of 64×8 pixels and image repetition rates of up to 100 Hz will be presented and the performance of a first 3D line sensor prototype will be demonstrated for typical road test scenarios. Furthermore, an outlook on the final 3D array camera development for road safety applications will be given.

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References

  1. P. Mengel, G. Doemens, and L. Listl, “Fast range imaging by CMOS sensor array through multiple double short time integration (MDSI)”, Proc. IEEE International Conference in Image Processing (ICIP 2001), Thessaloniki (Greece), Oct. 7–10, 2001, pp.169–172.

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  2. O. M. Schrey, O. Elkhalili, P. Mengel, M. Petermann, W. Brockherde, and B.J. Hosticka, “A 4×64 Pixel CMOS Image Sensor for 3D Measurement Applications”, Proc. European Solid-State Circuits Conference (ESSCIRC 2003), Estoril (Portugal), Sept 16–18, 2003, pp.333–336.

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  3. EC IP PReVENT, UseRcams deliverable 52.300.1, http://prevent-ip.org/en/pub-licdocuments/deliverables/d523001usercamsgeneralspecifications.htm

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© 2006 Springer-Verlag Berlin Heidelberg

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Mengel, P. et al. (2006). Three-Dimensional CMOS Image Sensor for Pedestrian Protection and Collision Mitigation. In: Valldorf, J., Gessner, W. (eds) Advanced Microsystems for Automotive Applications 2006. VDI-Buch. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-33410-6_3

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  • DOI: https://doi.org/10.1007/3-540-33410-6_3

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-33409-5

  • Online ISBN: 978-3-540-33410-1

  • eBook Packages: EngineeringEngineering (R0)

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