Abstract
Innovative packaging technologies and power aware design enable system shrinking considering automotive requirements. During the design process the coupling of very narrow positioned components and the interdependence of hardware, software, and packaging have to be considered. The relevant miniaturisation aspects are discussed on the exemplary application of a tire pressure monitoring system.
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References
Zeitreihen Verkehr 2004, Statistisches Bundesamt, Wiesbaden, Germany, 2005
Unfallursachen/Technische Mängel 2004, Statistisches Bundesamt, Wiesbaden, Germany, 2005.
Thiriez, K.; Bondy, N.: NHTSA’s Tire Pressure Special Study, US DOT/National Highway Traffic Safety Administration, Paper Number 256, United States of America, February 2001
Federal Motor Vehicle Safety Standards; Tire Pressure Monitoring Systems; Controls and Displays, DEPARTMENT OF TRANSPORTATION, National Highway Traffic Safety Administration, 49 CFR Parts 571 and 585, Docket No. NHTSA 2005-20586, RIN 2127-AJ23
Tränkler, H.-R.; Obermeier, E. (Hrsg.): Sensortechnik-Handbuch für Praxis und Wissenschaft, Springer Verlag, Berlin, Heidelberg, New York, 1998
Bureau of Transport Statistics, http://www.bts.gov/, Washington D.C., 2005
Association of German Automobile Manufacturers, Export Statistics, http://www.vda.de/de/aktuell/statistik/, Frankfurt/M., 2005
Polityko, D. D.; Guttowski, S.; John, W.; Reichl, H.: “Physical design and technology para¬me¬ters for vertical system-in-package integration,” Electronics Technology: Meeting the Chal¬lenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on Electronics Technology, no. pp. 413–419, May 19–20, 2005
Niedermayer, M.; Polityko, D.; Guttowski, S.; John, W.; Reichl, H.: Entwurfsmethodische Grundlagen zur Miniaturisierung von Autarken Verteilten Systemen, 10. GMM-Workshop Methoden und Werkzeuge für den Entwurf von Mikrosystemen, Cottbus, 21.10.2004
Vardaman, E.-J; Carpenter, C.; Matthew, L.: “System-in-Package, The New Wave in 3D Packaging”,Market and Technology Research Report of TechSearch International, Austin, Texas, USA, September 2005
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Thomasius, R. et al. (2006). Miniaturized Wireless Sensors for Automotive Applications. In: Valldorf, J., Gessner, W. (eds) Advanced Microsystems for Automotive Applications 2006. VDI-Buch. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-33410-6_26
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DOI: https://doi.org/10.1007/3-540-33410-6_26
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-33409-5
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