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A 3D study of the contact interface behavior using elastic-plastic constitutive equations

  • Chapter
Analysis and Simulation of Contact Problems

Part of the book series: Lecture Notes in Applied and Computational Mechanics ((LNACM,volume 27))

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Abstract

In this work a homogenization method presented by Bandeira et al [2,3,4] is enhanced in order to obtain by numerical simulation the interface law for the normal contact pressure based on statistical surface models. For this purpose elasticplastic behavior of the asperities is considered. Statistical evaluations of numerical simulations lead to a constitutive law for the contact pressure. The resulting law compared with other laws stemming from analytical investigations, like those presented by Greenwood Williamson [11] and Yovanovich [19, 32]. The non-penetration condition and the interface model for contact that takes into account the surface microstructure are investigated in detail.

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Author information

Authors and Affiliations

  1. Department of Civil Engineering at Presbyterian, Mackenzie University, São Paulo, Brazil

    A.A. Bandeira

  2. Department of Structural Engineering, Polytechnic School, University of São Paulo, São Paulo, Brazil

    P.M. Pimenta

  3. Institute for Mechanics and Computational Mechanics, University of Hannover, Hannover, Germany

    P. Wriggers

Authors
  1. A.A. Bandeira
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  2. P.M. Pimenta
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  3. P. Wriggers
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Editor information

Editors and Affiliations

  1. Institute of Mechanics and Computational Mechanics, University of Hannover, Appelstr. 9A, Hannover, 30167, Germany

    Peter Wriggers Professor Dr.

  2. Institute of Mechanics and Computational Mechanics, University of Hannover, Appelstr. 9A, Hannover, 30167, Germany

    Udo Nackenhorst Professor Dr.

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Bandeira, A., Pimenta, P., Wriggers, P. (2006). A 3D study of the contact interface behavior using elastic-plastic constitutive equations. In: Wriggers, P., Nackenhorst, U. (eds) Analysis and Simulation of Contact Problems. Lecture Notes in Applied and Computational Mechanics, vol 27. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-31761-9_35

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  • DOI: https://doi.org/10.1007/3-540-31761-9_35

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-31760-9

  • Online ISBN: 978-3-540-31761-6

  • eBook Packages: EngineeringEngineering (R0)

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