This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
Literatur
Holm R (1967) Electrical Contacts. Springer Verlag, Berlin, Heidelberg, New York
Vinaricky E (Hrsg) (2002) Elektrische Kontakte, Werkstoffe und Anwendungen. Springer, Berlin, Heidelberg, New York
Schimkat J (1996) Grundlagen und Modelle zur Entwicklung und Optimierung von Silizium-Mikrorelais. Dissertation TU Berlin, D 83
Hosaka H, Kuwano H, Yanagisawa K (1993) Electromagnetic Microrelays: Concepts and Fundamental Characteristics. Proc. Int. Workshop on Micro Electro Mechanical Systems, Fort Lauderdale/Florida, IEEE
Hyman D; Mehregany M (1999) Contact Physics of Gold Microcontacts for MEMS Switches. IEEE Trans. Comp. Pack. Tech. 22,3, 357–364
Paschen F (1889) Über die zum Funkenübergang in Luft, Wasserstoff und Kohlensäure bei verschiedenen Drucken erforderliche Potentialdifferenz. Annalen der Physik 37, 69–96
Dhariwal RS, Milne NG, Yang SJ, Beerschwinger U, Rump GFA, King PC (1994) Breakdown Electric Field Strength between Small Electrode Spacings in Air. Micro System Technologies, VDE-Verlag, Berlin, 663–672
Torres JM, Dhariwal RS (1998) Electric Field Breakdown at Micrometer Separations in Air and Vacuum. Micro System Technologies’ 98, Potsdam, VDE-Verlag, Berlin, Offenbach, 295–300
Rogge B, Schulz J, Mohr J, Thommes A, Menz W (1995) Fully Batch Fabricated Magnetic Microacturs Using Two Layer LIGA Process. Transducers 1995, Stockholm, June, 320–323
Taylor W, Allen M (1997) Batch fabricated electromagnetic microrelays. 45th Relay Conference, Lake Buena Vista, Florida, Proc. NARM
Fullin E, Gobet J, Tilmans HAC, Bergqvist J (1998) A new basic technology for magnetic micro-actuators. Int. Workshop Micro Electro Mechanical Systems, MEMS, Heidelberg, Proc. IEEE
Tilmans HAC et al. (1999) A Fully-Packaged Electromagnetic Microrelay. 12th International Conference on Micro Electro Mechanical Systems, MEMS, Proc. IEEE
Schimkat J, Kiesewetter L, Gevatter H-J, Arndt F, Steckenborn A, Schlaak HF (1994) Moving Wedge Actuator: An Electrostatic Actuator for Use in a Microrelay, Proc. Micro System Technologies’ 94, Berlin, VDE-Verlag, 989–996
Schlaak HF, Arndt F, Hanke M (1996) Silicon-microrelay with electrostatic moving wedge actuator — new functions and miniturisation by micromechanics, Proc. Micro System Technologies’ 96, Potsdam, VDE-Verlag, 463–468
Schlaak HF, Arndt F, Hanke M (1997) Silicon-microrelay — a small signal relay with electrostatic actuator, 45th Relay Conference, Lake Buena Vista, Florida, Proc. NARM
Schiele I, Huber J, Evers C, Hillerich B, Kozlowski F (1997) Micromechanical Relay with Electrostatic Actuation. Transducers’ 97, Chicago, June 16–19, 1165–1168
Schirmer ML, Zavracky PM, McGruer NE, Majunder S, Morrison RH, Potter DC, Adams GG, Krim J (1998) Design, characterization and application of surface micromachined, electrostatically actuated Microswitches. 46th Relay Conference, Oak Brook Hills, Illinois, Proc. NARM
Sano K et al. (1999) Study on Characteristics of Micro Machined Relay With Atmosphere Control. 47th Relay Conference, Newport Beach, California, Proc. NARM
Komura Y et al. (1999) Micro Machined Relay for High Frequency Application. 47th Relay Conference, Newport Beach, California, Proc. NARM
Pietsch K, Kiesewetter L (1998) Miniature Piezoelectric Relay with Low Operate Voltage and Short Switching Time Using a Monolithic Multilayer Bender Actuator. 6th International Conference on New Actuators, Actuator’ 98, Bremen, P 23
Riethmüller W, Benecke W (1988) Thermally excited silicon microactuators. IEEE Trans. Electron. Devices 35,6, 758–763
Seki T, Sakata M, Nakajima T, Matsumoto M (1997) Thermal buckling actutor for micro relays. Transducers 97, Int. Conf. on Solid-State Sensors and Actuators, Chicago, IEEE
Tomonari S et al. (2000) The Microrelay Thermally Actuated by the Silicon Bimetal. 48th Relay Conference, Proc. NARM
Liu Y, Li X, Abe T, Haga Y, Esashi M (2001) A Thermomechanicalal Relay with Microspring Contact Array. 14th Int. Conf. on MEMS, Interlaken, 2001, Proc. IEEE, 220–223
Heuberger A (1993) Mikromechanik. Springer, Berlin, Heidelberg, New York
Madou M (1997) Fundamentals of Microfabrication. CRC Press, New York
Menz W, Mohr J (1997) Mikrosystemtechnik für Ingenieure. 2. Aufl. VCH Verlagsgesellschaft, Weinheim
Tilmans HAC, van de Peer MDJ, Beyne E (2000) The Indent Reflow Sealing (IRS) Technique — A Method for the Fabrication of Sealed Cavities for MEMS Devices. IEEE J. Microelectromechanical Systems, 9,2, 206–217
Ruan M, Shen J, Wheeler CB (2001) Latching Micromagnetic Relays. IEEE J. Micromechanical Systems, 10,4, 511–517
Schlaak HF, Arndt F, Hanke M (1998) Switching characteristic of silicon-microrelay with electrostatic actuator. Int. Conf. on Electrical Contacts, Sep., Nürnberg, VDE-Verlag
Plötz F, Michaelis S, Fattinger G, Aigner R, Noe R (2001) Performance and Dynamics of a RF MEMS Switch. Transducers’ 01, 11th Int. Conf. Solid-State Sensors and Actuators, Munich, Springer
Park J-H et al. (2001) A 3-Voltage Actuated Micromachined RF Switch for Telecommunications Applications. Transducers’ 01, Munich, Springer
Yao ZJ et al. (1999) Micromachined Low-Loss Microwave Switches. IEEE J. Microelectromechanical Systems, 8,2, 129–134
Ulm M, Reimann M, Walter Th, Müller-Fiedler R, Kasper E (2001) Scalability of Capacitive RF MEMS Switches. Transducers’ 01, Munich, Springer
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2006 Springer-Verlag Berlin Heidelberg
About this chapter
Cite this chapter
Schlaak, H. (2006). Mikromechanische Relais. In: Gevatter, HJ., Grünhaupt, U. (eds) Handbuch der Mess- und Automatisierungstechnik im Automobil. VDI-Buch. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-29980-7_24
Download citation
DOI: https://doi.org/10.1007/3-540-29980-7_24
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-21205-8
Online ISBN: 978-3-540-29980-6
eBook Packages: Computer Science and Engineering (German Language)