Advertisement

Domain Decomposition Methods in Electrothermomechanical Coupling Problems

  • Ronald H.W. Hoppe
  • Yuri Iliash
  • Siegfried Ramminger
  • Gerhard Wachutka
Conference paper
Part of the Lecture Notes in Computational Science and Engineering book series (LNCSE, volume 40)

Summary

In this contribution, we are concerned with electrothermomechanical coupling problems as they arise in the modeling and simulation of high power electronic devices. In particular, we are faced with a hierarchy of coupled physical effects in so far as electrical energy is converted to Joule heat causing heat stresses that have an impact on the mechanical behavior of the devices and may lead to mechanical damage. Moreover, there are structural coupling effects due to the sandwich-like construction of the devices featuring multiple layers of specific materials with different thermal and mechanical properties. The latter motivates the application of domain decomposition techniques on nonmatching grids based on individual finite element discretizations of the substructures. We will address in detail the modeling aspects of the hierarchy of coupling phenomena as well as the discretization-related couplings in the numerical simulation of the operating behavior of the devices.

Keywords

Solder Joint Equivalence Stress Wire Bond Joule Heat Domain Decomposition Method 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. F. Brezzi, D. Marini, and P. Pietra. Numerical simulation of semiconductor devices. Comp. Math. Appl. Mech. Engrg., 75:493–514, 1989.MathSciNetCrossRefMATHGoogle Scholar
  2. R. Hoppe, Y. Iliash, Y. Kuznetsov, Y. Vassilevski, and B. Wohlmuth. Analysis and parallel implementation of adaptive mortar element methods. East-West J. Numer. Math., 6:223–248, 1998.MathSciNetMATHGoogle Scholar
  3. R. Hoppe and B. Wohlmuth. Adaptive multilevel techniques for mixed finite element discretizations of elliptic boundary value problems. SIAM J. Numer. Anal., 34:1658–1681, 1997.MathSciNetCrossRefMATHGoogle Scholar
  4. S. Ramminger, N. Seliger, and G. Wachutka. Reliability model for al wire bonds subjected to heel crack failures. Microelectronics Reliability, 40:1521–1525, 2000.CrossRefGoogle Scholar
  5. V. Tvergaard. Material failure by void growth to coalescence. Advances in Applied Mechanics, 27:83–151, 1989.CrossRefGoogle Scholar

Copyright information

© Springer-Verlag Berlin Heidelberg 2005

Authors and Affiliations

  • Ronald H.W. Hoppe
    • 1
    • 2
  • Yuri Iliash
    • 2
  • Siegfried Ramminger
    • 3
  • Gerhard Wachutka
    • 4
  1. 1.Department of MathematicsUniversity of HoustonHouston
  2. 2.Institute for MathematicsUniversity of AugsburgAugsburg
  3. 3.Siemens AG, Corporate TechnologyGermany
  4. 4.Physics of ElectrotechnologyMunich University of TechnologyMunich

Personalised recommendations