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Domain Decomposition Methods in Science and Engineering pp 193–200Cite as

Electronic Packaging and Reduction in Modelling Time Using Domain Decomposition

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Part of the Lecture Notes in Computational Science and Engineering book series (LNCSE,volume 40)

Summary

The domain decomposition method is directed to electronic packaging simulation in this article. The objective is to address the entire simulation process chain, to alleviate user interactions where they are heavy to mechanization by component approach to streamline the model simulation process.

Keywords

  • Solder Bump
  • Electronic Packaging
  • Domain Decomposition Method
  • Steady State Result
  • Defect Equation

These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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  • DOI: 10.1007/3-540-26825-1_16
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References

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Author information

Authors and Affiliations

  1. Fujitsu Laboratories of Europe Ltd, Physical and Life Sciences, Japan

    Peter Chow

  2. School of Computing and Mathematical Sciences, University of Greenwich, Greenwich

    Choi-Hong Lai

Authors
  1. Peter Chow
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  2. Choi-Hong Lai
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Editor information

Editors and Affiliations

  1. Moffett Field, CA

    Timothy J. Barth

  2. Bonn

    Michael Griebel

  3. New York

    David E. Keyes & Tamar Schlick & 

  4. Espoo

    Risto M. Nieminen

  5. Leuven

    Dirk Roose

  6. Fachbereich Mathematik und Informatik, Freie Universität Berlin, Arnimallee 2-6, 14195, Berlin, Germany

    Ralf Kornhuber

  7. Department of Mathematics, University of Houston, Philip G. Hoffman Hall 651, 77204-3008, Houston, TX, USA

    Ronald Hoppe

  8. Dassault Aviation, 78 Quai Marcel Dassault Cedex 300, 92552, St. Cloud, France

    Jacques Périaux

  9. Laboratoire Jacques-Louis Lions, Université Paris VI, 175 Rue de Chevaleret, 75013, Paris, France

    Olivier Pironneau

  10. Courant Institute of Mathematical Science, New York University, Mercer Street 251, 10012, New York, USA

    Olof Widlund

  11. Department of Mathematics Eberly College of Science, Pennsylvania Sate University, McAllister Building 218, 16802, University Park, PA, USA

    Jinchao Xu

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© 2005 Springer-Verlag Berlin Heidelberg

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Chow, P., Lai, CH. (2005). Electronic Packaging and Reduction in Modelling Time Using Domain Decomposition. In: , et al. Domain Decomposition Methods in Science and Engineering. Lecture Notes in Computational Science and Engineering, vol 40. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-26825-1_16

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