Skip to main content

Electronic Packaging and Reduction in Modelling Time Using Domain Decomposition

  • Conference paper

Part of the Lecture Notes in Computational Science and Engineering book series (LNCSE,volume 40)

Summary

The domain decomposition method is directed to electronic packaging simulation in this article. The objective is to address the entire simulation process chain, to alleviate user interactions where they are heavy to mechanization by component approach to streamline the model simulation process.

Keywords

  • Solder Bump
  • Electronic Packaging
  • Domain Decomposition Method
  • Steady State Result
  • Defect Equation

These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

This is a preview of subscription content, access via your institution.

Buying options

Chapter
USD   29.95
Price excludes VAT (USA)
  • DOI: 10.1007/3-540-26825-1_16
  • Chapter length: 8 pages
  • Instant PDF download
  • Readable on all devices
  • Own it forever
  • Exclusive offer for individuals only
  • Tax calculation will be finalised during checkout
eBook
USD   169.00
Price excludes VAT (USA)
  • ISBN: 978-3-540-26825-3
  • Instant PDF download
  • Readable on all devices
  • Own it forever
  • Exclusive offer for individuals only
  • Tax calculation will be finalised during checkout
Softcover Book
USD   219.99
Price excludes VAT (USA)

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  • A. C. C.-H. Lai and K. Pericleous. A defect equation approach for the coupling of subdomains in domain decomposition methods. Computers Math. Applic., 6:81–94, 1997.

    MathSciNet  CrossRef  Google Scholar 

  • P. Chow and C. Addison. Putting domain decomposition at the heart of a mesh-based simulation process. Int. J. Numer. Meth. Fluids, 40:1471–1484, 2002.

    CrossRef  Google Scholar 

  • P. Chow and M. Cross. An enthalpy control volume-unstructured mesh (cvum) algorithm for solidification by conduction only. Int. J. Numer. Meth. in Engg., 35:1849–1870, 1992.

    CrossRef  Google Scholar 

  • V. Voller and C. Prakash. A fixed grid numerical modelling methodology for convection-diffusion mushy region phase change problems. Int. J. of Heat and Mass Transfer, 30:1709–1719, 1987.

    CrossRef  Google Scholar 

  • V. Voller and C. Swaminathan. General source-based methods for solidificationn phase change. Numerical Heat Transfer, 19:175–190, 1991.

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Editor information

Editors and Affiliations

Rights and permissions

Reprints and Permissions

Copyright information

© 2005 Springer-Verlag Berlin Heidelberg

About this paper

Cite this paper

Chow, P., Lai, CH. (2005). Electronic Packaging and Reduction in Modelling Time Using Domain Decomposition. In: , et al. Domain Decomposition Methods in Science and Engineering. Lecture Notes in Computational Science and Engineering, vol 40. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-26825-1_16

Download citation