Electronic Packaging and Reduction in Modelling Time Using Domain Decomposition

  • Peter Chow
  • Choi-Hong Lai
Conference paper
Part of the Lecture Notes in Computational Science and Engineering book series (LNCSE, volume 40)


The domain decomposition method is directed to electronic packaging simulation in this article. The objective is to address the entire simulation process chain, to alleviate user interactions where they are heavy to mechanization by component approach to streamline the model simulation process.


Solder Bump Electronic Packaging Domain Decomposition Method Steady State Result Defect Equation 
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Copyright information

© Springer-Verlag Berlin Heidelberg 2005

Authors and Affiliations

  • Peter Chow
    • 1
  • Choi-Hong Lai
    • 2
  1. 1.Fujitsu Laboratories of Europe Ltd, Physical and Life SciencesJapan
  2. 2.School of Computing and Mathematical SciencesUniversity of GreenwichGreenwich

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