Conclusion
A new kind of material as organic-inorganic hybrids with tuneable properties depending on the composition and synthesis conditions, have been used to encapsulate multichip devices.
These organic-inorganic materials offer promising properties for millimetre optoelectronic packaging such as the control refractive indices and thicknesses, thermostability, good miscibility, low shrinkage, optical transparency and low microwave losses.
Type-II hybrids appear to be more suitable materials for optoelectronic application due to the low shrinkage, low thermal expansion coefficients, low microwave losses and an increase in the Tg value, which emerges as a single value indicating good miscibility. These effects may be attributed to the covalent bonds between the organic and inorganic domains.
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Rapún, N. (2005). Packaging Materials: Organic-Inorganic Hybrids for Millimetre-Wave Optoelectronics. In: Zschech, E., Whelan, C., Mikolajick, T. (eds) Materials for Information Technology. Engineering Materials and Processes. Springer, London. https://doi.org/10.1007/1-84628-235-7_32
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DOI: https://doi.org/10.1007/1-84628-235-7_32
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