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“Nanoreliability” — Fracture Mechanics on the Way from Micro to Nano

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Abstract

Thermo-mechanical compatibility” (TMC) of different micro- and nanomaterials in electronic and mechatronic systems is one mayor reason for troubles in the field of reliability and life-time of “high-tech” applications. Problems of thermal misfit (or mismatch) have become more and more important in the recent years because more than 60 percent of failure events in modern microelectronics are more or less directly connected with thermal misfit problems. The interface regions between the different materials, e.g. of a chip interconnection layer within a microsensor or a microactuator, is very important for the reliability of the component and of the whole system.

Keywords

  • Digital Image Correlation
  • Mechatronic System
  • Solder Interconnect
  • Digital Image Correlation Technique
  • Crack Evaluation

These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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  • DOI: 10.1007/1-4020-4972-2_3
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References

  1. Michel, B., Testing at Micro and Nanoscale, EuroSIME, European Conf. On Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics, Berlin, 18–20 April 2005.

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  2. Michel, B., Keller, J., NanoDAC — A New Technique for Micro-and Nanomechanical Reliability Analysis of Lead-free Solder Interconnects, Int. Conf. on Lead-free Soldering, Toronto, Canada, 24–26 May 2005.

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  3. Walter, H., Dudek, R., Michel, B., Fracture and Fatigue Behaviour of MEMS Related Micro Materials, Int. Conf. on Fracture (ICF 11), Turin, Italy, 20–25 March 2005.

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  4. Michel, B., Fracture Electronics and Thermo-Mechanical Compatibility (TMC) of Microcomponents in High-Tech Systems, Int. Conf. Micro Materials 2000, Berlin, 17–19 April 2000.

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  5. Michel, B., Experimental Mechanics on the Way from Micro to Nano, Exp. Technique 29 (2005) 2, 3–5.

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© 2006 Springer

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Michel, B. (2006). “Nanoreliability” — Fracture Mechanics on the Way from Micro to Nano. In: Gdoutos, E.E. (eds) Fracture of Nano and Engineering Materials and Structures. Springer, Dordrecht. https://doi.org/10.1007/1-4020-4972-2_3

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  • DOI: https://doi.org/10.1007/1-4020-4972-2_3

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-1-4020-4971-2

  • Online ISBN: 978-1-4020-4972-9

  • eBook Packages: EngineeringEngineering (R0)