Abstract
There have been many publications on solder joint life prediction models in the last few years. Many researchers have carried out mechanical fatigue and creep tests on bulk specimens in order to develop a more accurate life prediction model. Some others measured the deformation of the specimen and made the relationship between the deformation and the fatigue life. Other researchers have carried out thermal cycling tests and made life prediction model using the FEA results.
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References
Bonda, N.R., Noyan, I.C., IEEE transactions on components, packaging, and manufacturing technology, vol 19, no 2, 208–212, 1996
Park, Tae-Sang, A study on mechanical fatigue behaviours of ball grid array solder joints for electronic packaging, Doctoral Thesis, KAIST, DME985155, 2004
Kim, Ilho, A study on thermal fatigue behaviour of BGA package, Master’s Thesis, KAIST, MME20023132, 2003
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Kim, I., Park, TS., Lee, SB. (2006). A Mechanistic Model for the Thermal Fatigue Behavior of the Lead-Free Solder Joints. In: Gdoutos, E.E. (eds) Fracture of Nano and Engineering Materials and Structures. Springer, Dordrecht. https://doi.org/10.1007/1-4020-4972-2_356
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DOI: https://doi.org/10.1007/1-4020-4972-2_356
Publisher Name: Springer, Dordrecht
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