Abstract
Recent advances in MEMS technology have led to development of a multitude of new devices. However applications of these devices are hampered by challenges posed by their integration and packaging (Wei et al., 2005). Current trend in micro/nanosystems is to produce ever smaller, lighter, and more capable devices at a lower cost than ever before. In addition, the finished products have to operate at very low power and in very adverse conditions while assuring durable and reliable performance (Pryputniewicz et al., 2001).
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References
Pryputniewicz, R. J., T. F. Marinis, D. S. Hanson, and C. Furlong, 2001, “New approach to development of MEMS packaging for inertial sensors,” Paper No. IMECE2001/MEMS-22906, Am Soc. Mech. Eng., New York, NY.
Pryputniewicz, R. J., E. Shepherd, J. J. Allen, and C. Furlong, 2003, “University — National Laboratory alliance for MEMS education,” Proc. 4 th Internat. Symp. on MEMS and Nanotechnology (4 th-ISMAN), Charlotte, NC, pp. 364–371.
Pryputniewicz, R. J., T. F. Marinis, J. W. Soucy, P. Hefti, and A. R. Klempner, 2006, “A metal interposer for isolating MEMS devices from package stresses,” in press, Proc. EFC-16, Alexandoupolis, Greece.
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Pryputniewicz, R.J. (2006). MEMS: Recent Advances and Current Challenges. In: Gdoutos, E.E. (eds) Fracture of Nano and Engineering Materials and Structures. Springer, Dordrecht. https://doi.org/10.1007/1-4020-4972-2_10
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DOI: https://doi.org/10.1007/1-4020-4972-2_10
Publisher Name: Springer, Dordrecht
Print ISBN: 978-1-4020-4971-2
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