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SPM Investigation of Thiolated Gold Nanoparticle Patterns Deposited on Different Self-Assembled Substrates

  • F. Sbrana
  • M.T. Parodi
  • D. Ricci
  • E. Di Zitti
Part of the NATO Science Series II: Mathematics, Physics and Chemistry book series (NAII, volume 186)

Abstract

We present the results of a Scanning Probe Microscopy (SPM) investigation of ordered nanosized metallo-organic structures. Our aim is to investigate the organization and stability of thiolated gold nanoparticles in a compact pattern when deposited onto gold substrates functionalized with self-assembled monolayers made from two molecules that differ essentially in their terminating group: 1,4-benzenedimethanethiol and 4-methylbenzylthiol.

The dodecanethiol capped gold-nanoparticles were synthesized in a two-phase liquid-liquid system. Cluster size-selection by chromatographic technique was performed in order to obtain a narrow core diameter distribution peaked around 2 nm. A Langmuir film of size-selected nanoparticles was formed at the air-water interface using the multi-step creep method and was transferred onto the functionalized substrates.

Overall quality assessment was performed by Transmission Electron Microscopy image analysis. Room temperature scanning tunneling microscopy images of nanoparticles arranged in compact patterns deposited on these functionalized substrates are shown. A high degree of 2-D local organization is found and the role of 1,4-benezenedimethanethiol as grafting element between the gold nanoparticle pattern and the substrate is investigated.

Keywords

Langmuir Film Compact Pattern Scan Probe Microscopy Investigation Step Creep Gold Nanoparticle Pattern 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Kluwer Academic Publishers 2005

Authors and Affiliations

  • F. Sbrana
    • 1
  • M.T. Parodi
    • 1
  • D. Ricci
    • 1
  • E. Di Zitti
    • 1
  1. 1.Department of Biophysical and Electronic EngineeringUniversity of GenoaGenoaItaly

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